EP2AGX190EF29I3

The EP2AGX190EF29I3 is an Intel Arria II GX field-programmable gate array (FPGA) supplied in a 780-ball BGA FCBGA package. It offers a large pool of programmable logic elements combined with embedded RAM and a high I/O count to support complex, custom digital designs.

Rated for industrial operation, this device targets applications that require substantial on-chip logic, embedded memory, and robust I/O in a compact surface-mount package.

Key Features

• High logic density — 181,165 logic elements (cells) to implement complex digital functions and custom architectures.
• Significant embedded memory — approximately 9.7 Mbits of on-chip RAM for data buffering, state storage, and local memory needs.
• Extensive I/O — 372 user I/O pins for broad connectivity to external devices, peripherals, and interfaces.
• Industrial temperature range — specified operation from −40 °C to 100 °C for deployment in industrial environments.
• Core supply range — core voltage supply specified at 870 mV to 930 mV to match system power rails and design requirements.
• Compact, surface-mount package — 780-BBGA (supplier package: 780-FBGA, 29×29) for high-density PCB integration.
• RoHS compliant — meets environmental requirements for lead-free manufacturing.

Typical Applications

• Industrial control — industrial-grade temperature rating and robust I/O make it suitable for control systems and automation modules.
• Custom embedded logic — large logic element count and embedded RAM enable implementation of tailored datapaths, state machines, and control logic.
• I/O-intensive interfaces — high I/O count supports designs that need many sensors, actuators, or external interfaces.

Unique Advantages

• High on-chip integration: Large logic capacity and nearly 9.7 Mbits of embedded RAM reduce dependence on external components and simplify board-level design.
• Designed for industrial environments: Extended −40 °C to 100 °C operating range supports deployments in demanding temperature conditions.
• Dense connectivity: 372 I/O pins provide flexibility to connect multiple peripherals and interfaces without complex multiplexing.
• Compact BGA footprint: 780-ball FCBGA package enables high-density PCB layouts while maintaining surface-mount assembly compatibility.
• Regulatory readiness: RoHS compliance supports lead-free manufacturing processes.

Why Choose EP2AGX190EF29I3?

The EP2AGX190EF29I3 positions itself as a high-capacity, industrial-grade FPGA option within the Arria II GX family, combining substantial logic resources, embedded memory, and extensive I/O in a compact 780-ball FCBGA package. It is well suited to engineers and system designers building industrial and embedded systems that require programmable, high-density logic and reliable operation across a wide temperature range.

With clear electrical and package specifications— including a defined core voltage range and RoHS compliance—this device offers a practical platform for scalable, durable designs where on-chip resources and I/O density are key selection criteria.

Request a quote or submit an inquiry today to discuss availability, pricing, and lead times for EP2AGX190EF29I3.