EP2AGX190EF29C5N

The EP2AGX190EF29C5N is an Arria II GX family FPGA from Intel, offered in a 780-BBGA (FCBGA) package. It delivers a high-density programmable fabric with 181,165 logic elements, a large on-chip memory resource, and a substantial I/O count for complex digital designs.

Designed for commercial-grade applications, this device targets system designs that require significant logic capacity, embedded memory, and a high pin-count I/O footprint while operating within a standard commercial temperature range.

Key Features

• Logic Capacity — 181,165 logic elements to implement large combinational and sequential logic networks.
• Embedded Memory — 10,177,536 bits of on-chip RAM, approximately 10.18 Mbits of embedded memory for buffering, state storage, and data movement.
• I/O Count — 372 I/O pins to support dense peripheral interfacing and multi-channel connectivity.
• Core Voltage — Core supply range from 870 mV to 930 mV for the device core and periphery power domains.
• Package & Mounting — 780-BBGA (FCBGA) package; supplier device package listed as 780-FBGA (29×29). Surface-mount mounting type.
• Commercial Grade & Temperature — Commercial grade device rated for 0 °C to 85 °C operation.
• Standards & Compliance — RoHS compliant for environmental and manufacturing considerations.

Typical Applications

• High-density interface aggregation — The 372 I/O count enables designs that connect multiple external interfaces or parallel channels directly to the FPGA.
• Large logic implementations — 181,165 logic elements provide the resources needed for complex state machines, control logic, and custom datapaths.
• On-chip buffering and storage — Approximately 10.18 Mbits of embedded memory supports on-chip data buffering, FIFOs, and intermediate storage.
• Commercial electronic systems — The 0 °C to 85 °C rating and commercial grade designation align this device with standard commercial product environments.

Unique Advantages

• High logic density: 181,165 logic elements let designers integrate substantial custom logic without external glue logic.
• Significant on-chip memory: Over 10 million bits of RAM reduces dependence on external memory for many buffering and stateful tasks.
• Robust I/O capacity: 372 I/O pins simplify system-level routing for multi-channel and multi-interface designs.
• Low-voltage core operation: 870–930 mV core supply supports core power planning and thermal budgeting for dense FPGA deployments.
• Surface-mount, high-pin-count package: 780-BBGA (29×29) package provides a compact, manufacturable solution for board-level integration.
• RoHS compliant: Supports environmental and assembly process requirements for commercial products.

Why Choose EP2AGX190EF29C5N?

The EP2AGX190EF29C5N Arria II GX FPGA combines a large logic element count, substantial embedded memory, and a high I/O complement in a 780-BBGA surface-mount package. Its commercial-grade temperature rating and RoHS compliance make it suitable for mainstream electronic products that require significant on-chip resources and flexible I/O integration.

This device is well suited to design teams and projects that need to consolidate logic, memory, and interfaces into a single programmable device while maintaining predictable power and thermal characteristics based on the specified core voltage and operating range.

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