EP2AGX190EF29C4G

The EP2AGX190EF29C4G is an Intel Arria II GX field-programmable gate array supplied in a 780-ball FCBGA package. It provides a large logic fabric and substantial on-chip memory for complex, configurable digital designs. This device is targeted at designs requiring high logic capacity, significant embedded memory, and a wide set of user I/O within a compact surface-mount package.

Key Features

• Core Logic 181,165 logic elements enable implementation of large-scale programmable logic functions and complex datapaths.
• Configurable Logic Blocks 7,612 configurational logic units (reported) to structure and partition designs across the device.
• Embedded Memory Approximately 10.18 Mbits of on-chip RAM for buffering, FIFOs, and local storage to support memory-intensive logic.
• I/O Capacity 372 user I/O pins to support multiple parallel interfaces and external device connections.
• Power Operating core voltage specified from 870 mV to 930 mV for regulated supply design and power budgeting.
• Package & Mounting 780-ball BGA (29 × 29) FCBGA package designed for surface-mount assembly, offering a compact footprint for dense system boards.
• Temperature & Grade Commercial temperature range of 0 °C to 85 °C, suitable for standard commercial embedded applications.
• Environmental RoHS compliant to meet common environmental and regulatory requirements.

Typical Applications

• High-density logic and signal processing — Implement large-scale programmable algorithms and parallel datapaths using the device's 181,165 logic elements and structured logic resources.
• Memory-intensive designs — Use approximately 10.18 Mbits of embedded RAM for buffering, packet storage, or local data handling within FPGA-based systems.
• I/O-rich interface bridging — Leverage 372 user I/O pins to connect multiple external peripherals, sensors, or parallel interfaces on a single FPGA.
• Prototyping and system integration — Compact 780-ball FCBGA package and surface-mount mounting support integration into prototype and production boards where board space is constrained.

Unique Advantages

• High logic capacity: 181,165 logic elements allow implementation of complex control, datapath, and custom-processing logic without external ASICs.
• Substantial embedded memory: Approximately 10.18 Mbits of on-chip RAM reduces dependence on external memory for many buffering and temporary-storage needs.
• Ample I/O: 372 user I/O pins provide flexibility to interface with numerous external devices or parallel buses without multiplexing compromises.
• Compact, production-ready package: 780-ball FCBGA (29×29) supports high-density board designs and conventional surface-mount manufacturing processes.
• Controlled supply range: Defined 870 mV–930 mV core voltage simplifies power supply design and enables precise power management.
• Commercial-grade operation: Specified 0 °C to 85 °C operating range and RoHS compliance align with common commercial product requirements.

Why Choose EP2AGX190EF29C4G?

The EP2AGX190EF29C4G combines large programmable logic capacity, significant embedded memory, and extensive I/O in a compact FCBGA package, making it well suited for designers who need to consolidate complex logic and memory-driven functions onto a single FPGA. Its defined voltage and commercial temperature range support straightforward integration into standard embedded systems.

This device is appropriate for design teams building memory- and logic-intensive applications that require a high I/O count and compact board footprint, delivering long-term value through a balance of integration, performance, and manufacturability.

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