EP2AGX125EF35I5G

The EP2AGX125EF35I5G is an Intel Arria II GX field programmable gate array supplied in a 1152-BBGA FCBGA package. It delivers substantial programmable logic capacity, embedded memory, and a high number of I/O pins for complex, configurable system designs.

Designed and rated for industrial use, this FPGA targets designs that require high logic density, significant on-chip memory, and robust operating ranges, while supporting compact surface-mount board layouts.

Key Features

• Programmable Logic  Contains 118,143 logic elements for implementing substantial custom logic, datapaths, and control functions.
• Embedded Memory  Provides approximately 8.3 Mbits of embedded memory to support buffering, lookup tables, and on-chip data storage without external RAM.
• High I/O Count  Offers 452 I/O pins to support numerous external interfaces and reduce the need for additional I/O expanders.
• Package and Mounting  Available in a 1152-BBGA (FCBGA) supplier device package (1152-FBGA, 35×35) with surface-mount mounting for dense PCB integration.
• Power  Core supply voltage range of 870 mV to 930 mV to match compatible power rail designs.
• Operating Range  Industrial-grade operating temperature range of −40°C to 100°C for deployment in demanding environments.
• Compliance  RoHS-compliant construction for regulatory and manufacturing alignment.

Typical Applications

• Industrial Control and Automation  Industrial-grade rating and wide temperature range support use in factory automation and control systems requiring reliable programmable logic.
• High-Density I/O Systems  452 I/O pins allow integration with multiple sensors, actuators, and external peripherals in complex I/O-heavy designs.
• Embedded Memory-Intensive Logic  Approximately 8.3 Mbits of embedded memory combined with 118,143 logic elements enables local buffering, state machines, and data-path implementations without external memory.
• Compact, Surface-Mount Designs  1152-BBGA FCBGA packaging supports compact, high-density PCB layouts for space-constrained applications.

Unique Advantages

• High Logic Capacity: 118,143 logic elements provide the resources needed for large-scale custom logic and parallel processing.
• Substantial On-Chip Memory: Approximately 8.3 Mbits of embedded memory reduces reliance on external RAM and simplifies board-level design.
• Extensive I/O Availability: 452 I/Os enable broad connectivity options and help minimize additional interface components.
• Industrial Reliability: Rated for −40°C to 100°C operation to meet the environmental demands of industrial applications.
• Compact FCBGA Package: 1152-BBGA (35×35) footprint supports dense integration and surface-mount assembly workflows.
• Controlled Core Supply Range: 870–930 mV core voltage specification supports predictable power design and budgeting.

Why Choose EP2AGX125EF35I5G?

The EP2AGX125EF35I5G positions itself as a robust programmable-logic building block for designs that need a balance of high logic density, on-chip memory, and extensive I/O in a compact surface-mount package. Its industrial-grade temperature range and RoHS compliance make it suitable for long-lived, environmentally demanding applications.

Engineers and procurement teams seeking a scalable FPGA resource with measurable on-chip capacity and clear electrical and thermal limits will find this device appropriate for complex embedded systems, high-density interfacing, and industrial deployments backed by Intel's Arria II GX family pedigree.

Request a quote or submit an inquiry for EP2AGX125EF35I5G to receive pricing, availability, and ordering information tailored to your project requirements.