EP2AGX190EF29C4

The EP2AGX190EF29C4 is an Intel Arria II GX field-programmable gate array (FPGA) delivered in a 780‑FBGA (29×29) surface-mount package. It provides a high-density programmable-logic fabric with substantial embedded memory and a large I/O count for complex, I/O‑intensive designs.

Designed as a commercial-grade device (0 °C to 85 °C), this Arria II GX part targets systems that require significant logic capacity, embedded RAM, and flexible I/O while operating at the specified core supply range of 870 mV to 930 mV.

Key Features

• Logic Capacity — 181,165 logic elements, enabling complex combinational and sequential logic implementations.
• Embedded Memory — approximately 10.18 Mbits of on-chip RAM for buffering, FIFO, and embedded storage needs.
• I/O Resources — 372 programmable I/O pins to support broad interfacing and high pin-count designs.
• Core Power — specified voltage supply of 870 mV to 930 mV to match Arria II GX core requirements.
• Programmable I/O and Periphery — device handbook references programmable I/O element delay and programmable output buffer delay, plus transceiver and periphery performance specifications for Arria II GX devices.
• Package and Mounting — 780‑FBGA (29×29) FCBGA package in a surface-mount form factor for board-level integration.
• Operating Grade — commercial grade with an operating temperature range of 0 °C to 85 °C.
• RoHS Compliant — conforms to RoHS environmental requirements.

Typical Applications

• High-density logic systems — implement large-scale custom logic, state machines, and datapath functions using the 181,165 logic elements and on-chip RAM.
• I/O‑intensive interfaces — leverage 372 I/Os for systems that require many external connections or mixed signal interfacing.
• Embedded buffering and memory — use the approximately 10.18 Mbits of embedded memory for packet buffering, FIFOs, and intermediary storage.

Unique Advantages

• High logic density: 181,165 logic elements provide the fabric necessary for complex programmable designs without external logic.
• Substantial on‑chip memory: approximately 10.18 Mbits of embedded RAM reduces dependence on external memory for many buffering and storage tasks.
• Large I/O count: 372 I/Os simplify board routing and reduce the need for external I/O expanders in high‑pin‑count systems.
• Commercial temperature rating: 0 °C to 85 °C supports a wide range of mainstream electronic products and environments.
• Surface-mount FCBGA package: 780‑FBGA (29×29) provides a compact footprint for high-density PCB assemblies.
• Standards-focused I/O/periphery references: The Arria II GX device handbook details programmable I/O timing, periphery performance, and transceiver specifications for system-level tuning.

Why Choose EP2AGX190EF29C4?

The EP2AGX190EF29C4 places a substantial combination of programmable logic, embedded memory, and I/O resources into a single commercial-grade Arria II GX FPGA package. Its specifications make it suitable for designers seeking a high-density, integrated FPGA solution that balances logic capacity, on-chip RAM, and a broad I/O set within a defined commercial operating range and core voltage window.

For projects that demand scalable logic capacity and meaningful on-chip memory while remaining within commercial temperature and power specifications, this Arria II GX device offers a clear, specification-backed option with documented periphery and I/O configurability in the device handbook.

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