EP2AGX190EF29C5

IC FPGA 372 I/O 780FBGA
Part Description

Arria II GX Field Programmable Gate Array (FPGA) IC 372 10177536 181165 780-BBGA, FCBGA

Quantity 946 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package780-FBGA (29x29)GradeCommercialOperating Temperature0°C – 85°C
Package / Case780-BBGA, FCBGANumber of I/O372Voltage870 mV - 930 mV
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unknown
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs7612Number of Logic Elements/Cells181165
Number of GatesN/AECCN3A001A7AHTS Code8542.39.0001
QualificationN/ATotal RAM Bits10177536

Overview of EP2AGX190EF29C5 – Arria II GX FPGA — 181,165 logic elements, 372 I/Os, 780‑FBGA (29×29)

The EP2AGX190EF29C5 is an Arria II GX field programmable gate array (FPGA) offering a high logic density fabric with substantial embedded RAM and a broad I/O complement. As an Arria II GX device, its datasheet documents electrical and switching characteristics including transceiver performance, I/O timing, and on‑chip memory — suitable for designs that require programmable logic, on‑chip memory resources, and configurable I/O.

Key Features

  • Logic Capacity — 181,165 logic elements providing significant programmable logic resources for complex designs.
  • Logic Array Blocks — 7,612 logic array blocks (LABs) for structured logic partitioning and resource organization.
  • Embedded Memory — Approximately 10.18 Mbits of total on‑chip RAM bits for buffering, packet storage, and intermediate data processing.
  • I/O Density — 372 I/O pins to accommodate dense external connectivity and multiple interface implementations.
  • Package — 780‑FBGA (29×29) FCBGA / 780‑BBGA package case in a surface‑mount form factor for compact board integration.
  • Power — Core voltage supply range of 0.870 V to 0.930 V to match system power budgeting and regulator selection.
  • Operating Range — Commercial temperature grade rated from 0 °C to 85 °C for standard commercial deployments.
  • RoHS Compliant — Meets RoHS environmental compliance requirements.
  • Documented Electrical & I/O Characteristics — Datasheet and device handbook detail device electrical limits, transceiver performance, and programmable I/O timing for design validation.

Typical Applications

  • High‑performance communications — Implement protocol logic, packet buffering, and transceiver interfaces where programmable serial links and custom packet handling are required.
  • Video and signal processing — Use the high logic count and embedded RAM for frame buffering, pipeline processing, and custom image/video pipelines.
  • Networking and infrastructure — Deploy in switching, routing, or network acceleration functions that need configurable logic and on‑chip memory for packet processing.
  • Custom digital systems — Realize application‑specific accelerators, protocol bridges, or control logic requiring a flexible FPGA fabric and substantial I/O.

Unique Advantages

  • High logic density: 181,165 logic elements enable large, complex designs without immediate part scaling.
  • Substantial on‑chip memory: Approximately 10.18 Mbits of embedded RAM supports buffering and data‑intensive operations on chip.
  • Broad connectivity: 372 I/Os provide flexibility for multiple parallel interfaces and mixed signal chains.
  • Compact FCBGA package: 780‑FBGA (29×29) package delivers a dense footprint for space‑constrained PCBs while maintaining thermal and signal routing characteristics of a BGA.
  • Commercial temperature rating: 0 °C to 85 °C aligns with standard commercial product deployment needs.
  • Standards‑oriented documentation: Device handbook coverage of electrical characteristics, transceiver specs, and I/O timing aids engineering verification and integration.

Why Choose EP2AGX190EF29C5?

The EP2AGX190EF29C5 positions itself as a commercially graded Arria II GX FPGA that balances high logic capacity, ample embedded RAM, and a wide I/O set within a compact 780‑FBGA package. Its documented electrical and switching characteristics support engineering validation for applications that demand configurable logic, on‑chip memory, and robust I/O connectivity.

This device is well suited for system and board designers who need a scalable, programmable solution for communications, video, networking, or custom digital acceleration where on‑chip memory and high logic density are priorities.

Request a quote or submit a procurement inquiry to check pricing and availability for EP2AGX190EF29C5 and to discuss volume supply or lead‑time needs.

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