EP2AGX190EF29C5
| Part Description |
Arria II GX Field Programmable Gate Array (FPGA) IC 372 10177536 181165 780-BBGA, FCBGA |
|---|---|
| Quantity | 946 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Device Package | 780-FBGA (29x29) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 780-BBGA, FCBGA | Number of I/O | 372 | Voltage | 870 mV - 930 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unknown | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 7612 | Number of Logic Elements/Cells | 181165 | ||
| Number of Gates | N/A | ECCN | 3A001A7A | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 10177536 |
Overview of EP2AGX190EF29C5 – Arria II GX FPGA — 181,165 logic elements, 372 I/Os, 780‑FBGA (29×29)
The EP2AGX190EF29C5 is an Arria II GX field programmable gate array (FPGA) offering a high logic density fabric with substantial embedded RAM and a broad I/O complement. As an Arria II GX device, its datasheet documents electrical and switching characteristics including transceiver performance, I/O timing, and on‑chip memory — suitable for designs that require programmable logic, on‑chip memory resources, and configurable I/O.
Key Features
- Logic Capacity — 181,165 logic elements providing significant programmable logic resources for complex designs.
- Logic Array Blocks — 7,612 logic array blocks (LABs) for structured logic partitioning and resource organization.
- Embedded Memory — Approximately 10.18 Mbits of total on‑chip RAM bits for buffering, packet storage, and intermediate data processing.
- I/O Density — 372 I/O pins to accommodate dense external connectivity and multiple interface implementations.
- Package — 780‑FBGA (29×29) FCBGA / 780‑BBGA package case in a surface‑mount form factor for compact board integration.
- Power — Core voltage supply range of 0.870 V to 0.930 V to match system power budgeting and regulator selection.
- Operating Range — Commercial temperature grade rated from 0 °C to 85 °C for standard commercial deployments.
- RoHS Compliant — Meets RoHS environmental compliance requirements.
- Documented Electrical & I/O Characteristics — Datasheet and device handbook detail device electrical limits, transceiver performance, and programmable I/O timing for design validation.
Typical Applications
- High‑performance communications — Implement protocol logic, packet buffering, and transceiver interfaces where programmable serial links and custom packet handling are required.
- Video and signal processing — Use the high logic count and embedded RAM for frame buffering, pipeline processing, and custom image/video pipelines.
- Networking and infrastructure — Deploy in switching, routing, or network acceleration functions that need configurable logic and on‑chip memory for packet processing.
- Custom digital systems — Realize application‑specific accelerators, protocol bridges, or control logic requiring a flexible FPGA fabric and substantial I/O.
Unique Advantages
- High logic density: 181,165 logic elements enable large, complex designs without immediate part scaling.
- Substantial on‑chip memory: Approximately 10.18 Mbits of embedded RAM supports buffering and data‑intensive operations on chip.
- Broad connectivity: 372 I/Os provide flexibility for multiple parallel interfaces and mixed signal chains.
- Compact FCBGA package: 780‑FBGA (29×29) package delivers a dense footprint for space‑constrained PCBs while maintaining thermal and signal routing characteristics of a BGA.
- Commercial temperature rating: 0 °C to 85 °C aligns with standard commercial product deployment needs.
- Standards‑oriented documentation: Device handbook coverage of electrical characteristics, transceiver specs, and I/O timing aids engineering verification and integration.
Why Choose EP2AGX190EF29C5?
The EP2AGX190EF29C5 positions itself as a commercially graded Arria II GX FPGA that balances high logic capacity, ample embedded RAM, and a wide I/O set within a compact 780‑FBGA package. Its documented electrical and switching characteristics support engineering validation for applications that demand configurable logic, on‑chip memory, and robust I/O connectivity.
This device is well suited for system and board designers who need a scalable, programmable solution for communications, video, networking, or custom digital acceleration where on‑chip memory and high logic density are priorities.
Request a quote or submit a procurement inquiry to check pricing and availability for EP2AGX190EF29C5 and to discuss volume supply or lead‑time needs.

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