EP2AGX125EF35I5

The EP2AGX125EF35I5 is an Arria II GX field programmable gate array (FPGA) in an industrial-grade speed grade. It integrates a high logic capacity and on-chip RAM with a large I/O complement in a 1152‑BBGA FCBGA package for surface-mount assembly.

Designed for system designs that require dense logic, substantial embedded memory, and extensive I/O, this device targets industrial applications where an extended operating temperature range and controlled core voltage are important design constraints.

Key Features

• Core Logic — 118,143 logic elements provide the programmable fabric to implement complex digital functions and custom logic architectures.
• Embedded Memory — Approximately 8.3 Mbits of on-chip RAM to support buffering, packet storage, and local data structures.
• I/O Density — 452 user I/Os to support wide parallel interfaces and high pin-count connectivity requirements.
• Package & Mounting — 1152‑BBGA FCBGA package (supplier device package: 1152‑FBGA, 35×35) with surface-mount mounting for compact board integration.
• Power — Core supply operating range of 870 mV to 930 mV to match targeted power-rail designs.
• Temperature & Grade — Industrial grade with an operating temperature range of −40 °C to 100 °C for deployment in demanding environments.
• Compliance — RoHS‑compliant component for regulatory alignment in electronics manufacturing.
• Arria II GX Family — Part of the Arria II device family; device documentation includes detailed electrical characteristics and transceiver performance specifications.

Typical Applications

• Industrial control and automation — Use the device’s logic density and industrial temperature rating to implement control algorithms, sequencing, and interface aggregation in industrial equipment.
• High-density I/O systems — Leverage 452 I/Os for designs that require multiple parallel interfaces, board-level aggregation, or large peripheral connectivity.
• Embedded processing and buffering — Approximately 8.3 Mbits of on-chip RAM supports local buffering, data staging, and intermediate storage for embedded systems.
• Prototyping and system integration — The FPGA’s programmable fabric and substantial resources enable hardware validation, custom IP integration, and system bring-up on production-intent packages.

Unique Advantages

• High logic capacity: 118,143 logic elements enable implementation of sizable custom logic blocks and multiple IP cores on a single device.
• Substantial on-chip memory: Approximately 8.3 Mbits of embedded RAM reduces external memory dependence and simplifies board design for many buffering and data-path needs.
• Extensive I/O connectivity: 452 I/Os provide the physical interface capacity to connect to multiple peripherals, sensors, or parallel buses without external multiplexing.
• Industrial suitability: Rated for −40 °C to 100 °C, supporting deployment in environments with wide temperature swings.
• Compact package: 1152‑BBGA FCBGA in a 35×35 supplier footprint enables high-density board implementations while keeping a small PCB area.
• Standards-conscious supply: RoHS compliance supports environmentally regulated manufacturing flows.

Why Choose EP2AGX125EF35I5?

The EP2AGX125EF35I5 combines a high number of logic elements, ample embedded RAM, and a large I/O count in an industrial-grade Arria II GX FPGA package. These characteristics make it a practical choice for designs that demand programmable logic density, local memory for data handling, and extensive connectivity while operating across a wide temperature range.

Engineers seeking a field-programmable solution with documented electrical characteristics and family-level documentation will find this device suitable for industrial systems, high-density interfaces, and embedded integration where on-chip resources and robust operating limits matter.

Request a quote or submit an inquiry to receive pricing and availability for EP2AGX125EF35I5 and to discuss how it fits your project requirements.