EP2AGX125EF35C6N

The EP2AGX125EF35C6N is an Intel Arria II GX field-programmable gate array (FPGA) in a 1152-BBGA FCBGA package. It provides a high-density programmable logic fabric combined with on-chip embedded memory and a large I/O complement for commercial electronic designs.

Designed for surface-mount assembly and commercial-grade operation, this device targets designs that require substantial logic capacity and embedded RAM within a compact, 35 × 35 mm package footprint.

Key Features

• Core Logic  Provides 118,143 logic elements for implementing complex custom digital functions.
• Embedded Memory  Approximately 8.316 Mbits of on-chip RAM to support buffering, state storage, and local data processing.
• I/O Density  452 I/O pins to support a broad mix of peripherals and high-pin-count interfaces.
• Power  Core supply range specified at 870 mV to 930 mV for core power rail design and budgeting.
• Package & Mounting  1152-BBGA (1152-FBGA, 35×35) FCBGA package, designed for surface-mount PCB assembly.
• Operating Range  Commercial grade with an ambient operating temperature range of 0 °C to 85 °C.
• Regulatory  RoHS compliant for environmental and manufacturing compliance.

Typical Applications

• Custom digital logic  Implement application-specific processing, state machines, and control logic that benefit from large programmable fabric.
• Prototyping and development platforms  Use the device where substantial on-chip logic and memory are needed to validate system architectures.
• I/O-intensive interfaces  Leverage the 452 I/O pins for boards requiring dense peripheral interfacing or multi-channel I/O.
• Embedded systems  Embed programmable logic and local memory to offload algorithms or provide deterministic hardware control within commercial-temperature systems.

Unique Advantages

• High logic capacity: 118,143 logic elements enable implementation of complex, multi-function designs without immediate need to partition across multiple devices.
• Substantial on-chip RAM: Approximately 8.316 Mbits of embedded memory reduces dependence on external RAM for buffering and temporary storage.
• Extensive I/O: 452 I/O pins offer flexibility for diverse interfaces and high channel counts.
• Compact, production-ready package: 1152-BBGA (35×35) FCBGA supports surface-mount assembly in compact board layouts.
• Low-voltage core operation: Core supply range of 870 mV to 930 mV helps with power-rail planning and integration into low-voltage system designs.
• Commercial grade and RoHS compliant: Designed for commercial temperature environments and compliant with RoHS requirements for manufacturing.

Why Choose EP2AGX125EF35C6N?

The EP2AGX125EF35C6N combines a large programmable fabric with meaningful on-chip memory and a high I/O count in a compact FCBGA package, making it a practical choice for commercial designs that require dense logic integration and local storage. Its specified core voltage range and commercial operating temperature make it suitable for production systems where predictable electrical and thermal planning is required.

Engineers and procurement teams looking for a high-capacity Arria II GX FPGA in a surface-mount 1152-BBGA package will find this device appropriate for applications that demand significant on-chip logic, I/O connectivity, and embedded RAM within a commercial-grade operating envelope.

Request a quote or submit a pricing inquiry today to evaluate EP2AGX125EF35C6N for your next design.