EP2AGX125EF35C6

The EP2AGX125EF35C6 is an Intel Arria II GX Field Programmable Gate Array (FPGA) in a 1152-ball FCBGA package designed for surface-mount board-level integration. It provides a high-density programmable fabric with 118,143 logic elements, approximately 8.3 Mbits of embedded memory, and 452 user I/Os for complex digital systems.

Built for commercial-grade applications, this device operates from a core supply range of 870 mV to 930 mV and is specified for an ambient operating temperature of 0 °C to 85 °C. The package and electrical characteristics support compact, high‑integration designs requiring substantial on-chip logic and I/O capacity.

Key Features

• Logic Capacity  118,143 logic elements to implement complex digital functions and large-scale programmable logic designs.
• Embedded Memory  Approximately 8.3 Mbits of on-chip RAM for buffering, state storage, and memory-intensive logic blocks.
• I/O Resources  452 I/O pins to support broad interfacing requirements across multiple banks and peripherals.
• Power  Core voltage supply range of 870 mV to 930 mV, enabling defined power planning and board-level power sequencing.
• Package & Mounting  1152-ball FCBGA package (supplier device package: 1152-FBGA, 35×35) optimized for surface-mount assembly and compact PCB layouts.
• Commercial Grade & Temperature Range  Rated for commercial operation with an ambient range of 0 °C to 85 °C.
• Compliance  RoHS-compliant to meet common environmental regulatory requirements.

Typical Applications

• High-density programmable logic  Implement large-scale custom digital algorithms and control logic using the device’s substantial logic element count and embedded memory.
• Board-level system integration  Use the 1152-ball FCBGA package and surface-mount form-factor for compact, production-ready PCBs.
• I/O‑intensive interfaces  Support designs that require many parallel or mixed-signal interfaces leveraging 452 I/Os.
• Commercial embedded systems  Deploy in commercial temperature environments where predictable operation between 0 °C and 85 °C is required.

Unique Advantages

• High logic density:  118,143 logic elements provide the capacity to consolidate multiple functions on a single device, reducing system complexity.
• Significant on-chip memory:  Approximately 8.3 Mbits of embedded RAM supports large buffering and state storage without external memory in many designs.
• Extensive I/O capability:  452 I/Os enable flexible connectivity for interfaces, sensors, and peripherals across a wide variety of board designs.
• Board-level practicality:  1152-ball FCBGA (35×35) packaging and surface-mount compatibility simplify assembly and save PCB area compared with multi‑chip solutions.
• Commercial readiness:  Rated operating range and RoHS compliance align with standard commercial product requirements and regulatory expectations.
• Vendor-backed device family:  Part of the Intel Arria II GX family, providing consistent device-level documentation and specification references.

Why Choose EP2AGX125EF35C6?

The EP2AGX125EF35C6 combines a large logic element count, substantial embedded memory, and broad I/O resources in a compact 1152-ball FCBGA surface-mount package, making it suitable for commercial embedded and system-level FPGA implementations that require high integration. Its defined core voltage range and commercial temperature rating support predictable system design and qualification processes.

Engineers and procurement teams seeking a single-device solution to consolidate complex digital functions, reduce BOM count, and maintain compliance with RoHS will find this Arria II GX device a practical choice backed by Intel device documentation.

Request a quote or submit an inquiry for pricing and availability to evaluate the EP2AGX125EF35C6 for your next design.