EP2AGX125EF35C4N

The EP2AGX125EF35C4N is an Arria II GX Field Programmable Gate Array (FPGA) IC manufactured by Intel. It delivers substantial on-chip logic and memory resources in a compact surface-mount FCBGA package suitable for commercial-grade designs.

Key on-chip resources include 118,143 logic elements, approximately 8.3 Mbits of embedded RAM, and 452 user I/Os, supporting designs that require significant logic capacity, embedded memory, and high I/O density. The device operates from a core supply range of 870 mV to 930 mV and is specified for 0 °C to 85 °C commercial operation.

Key Features

• Logic Capacity  118,143 logic elements for implementing complex programmable logic and custom digital functions.
• Embedded Memory  Approximately 8.3 Mbits (8,315,904 bits) of on-chip RAM to support buffering, packet storage, and local data processing.
• I/O Resources  452 user I/Os to accommodate high-pin-count interfaces and multi-channel connectivity requirements.
• Power Supply  Core voltage supply specified from 870 mV to 930 mV to match target system power rails and enable predictable power planning.
• Package and Mounting  1152-BBGA (FCBGA) package; supplier device package listed as 1152-FBGA (35×35). Surface-mount mounting type for standard PCB assembly.
• Commercial Temperature & Compliance  Commercial-grade device with operating temperature range 0 °C to 85 °C and RoHS compliance for regulatory alignment.

Unique Advantages

• Large programmable fabric: 118,143 logic elements provide the headroom to implement complex algorithms and multiple concurrent functions on a single device.
• Substantial embedded memory: Approximately 8.3 Mbits of on-chip RAM reduces external memory dependency for many buffering and local storage needs.
• High I/O density: 452 user I/Os enable interfacing to many parallel buses, sensors, or high-pin-count peripherals without additional I/O expanders.
• Compact FCBGA package: The 1152-BBGA (35×35) footprint balances pin count and board area for space-constrained commercial designs.
• Commercial operating range: Specified 0 °C to 85 °C operation is suitable for a wide range of commercial and enterprise applications.
• Regulatory readiness: RoHS compliance supports environmental and manufacturing requirements for many product lines.

Why Choose EP2AGX125EF35C4N?

The EP2AGX125EF35C4N combines a large programmable fabric, significant embedded RAM, and a high I/O count in a compact surface-mount FCBGA package, making it a practical choice for commercial designs that require integration of complex logic and substantial local memory. Its specified core voltage range and commercial temperature rating provide clear parameters for system power and thermal planning.

This Arria II GX device is positioned for designers who need to consolidate multiple digital functions into a single FPGA while maintaining predictable electrical and thermal requirements. The combination of on-chip resources and packaging options delivers a scalable building block for mid-to-high complexity programmable logic applications.

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