EP2AGX125EF35C4

The EP2AGX125EF35C4 is an Intel Arria II GX field programmable gate array (FPGA) in a 1152-ball FCBGA package. It delivers a high on-chip logic capacity with substantial embedded memory and a large I/O count for designs that require dense programmable logic and extensive peripheral interfacing.

As a commercial-grade device, this FPGA operates over a 0 °C to 85 °C range and supports core supply voltages from 870 mV to 930 mV, making it suitable for a wide range of standard commercial electronic applications.

Key Features

• Logic Capacity  118,143 logic elements provide a large fabric for implementing complex digital functions and custom pipelines.
• On-chip Memory  Approximately 8.3 Mbits of embedded memory to support buffering, lookup tables, and local storage for high-throughput designs.
• I/O Density  452 user I/Os enable broad connectivity to peripherals, sensors, and external interfaces without excessive external multiplexing.
• Package  1152-BBGA (supplier package: 1152-FBGA, 35×35 mm) surface-mount package for compact board-level integration.
• Power Range  Core supply voltage specified between 870 mV and 930 mV, allowing designs optimized for the device’s native core-voltage operating point.
• Commercial Grade  Rated for 0 °C to 85 °C operation to meet typical commercial application temperature requirements.
• RoHS Compliant  Conforms to lead-free manufacturing requirements for environmental and regulatory compliance.

Typical Applications

• High-density digital logic and prototyping  Use the large logic-element count to implement complex state machines, data-paths, and custom accelerators during development and production.
• Embedded memory buffering  Leverage the approximately 8.3 Mbits of on-chip RAM for packet buffering, frame storage, and intermediate data staging in throughput-sensitive designs.
• High-pin-count interfacing  The 452 I/Os support extensive peripheral and bus connections for systems requiring many external signals or parallel interfaces.
• Compact system integration  The 1152-ball FCBGA package enables dense board layouts where space and pin count are constrained.

Unique Advantages

• High logic scalability: 118,143 logic elements let designers scale algorithms and state machines without immediate part changes.
• Substantial embedded memory: Approximately 8.3 Mbits of on-chip RAM reduces dependence on external RAM for many buffering and storage tasks.
• Broad connectivity: 452 I/Os simplify interfacing to multiple peripherals and parallel buses, reducing external glue logic.
• Compact FCBGA packaging: 1152-ball package provides a high pin count in a compact footprint for dense PCBs.
• Commercial temperature and RoHS compliance: Ready for standard commercial deployments with environmental compliance for lead-free assembly.
• Predictable core-voltage range: Defined 870 mV–930 mV supply window supports voltage planning for power delivery and thermal management.

Why Choose EP2AGX125EF35C4

The EP2AGX125EF35C4 Arria II GX FPGA combines a large logic fabric, significant embedded memory, and a high I/O count in a single commercial-grade FCBGA package. It is well suited for designs that demand on-chip capacity for logic and memory while maintaining a compact board footprint and broad external connectivity.

Engineering teams and procurement looking for a verified Arria II GX family device can rely on the clear electrical and thermal operating points—core voltage range and 0 °C to 85 °C rating—along with RoHS compliance for mainstream production environments.

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