EP2AGX125EF35C5

The EP2AGX125EF35C5 is an Intel Arria II GX field programmable gate array (FPGA) in a 1152‑FBGA package, offered as a commercial‑grade device. It provides a high‑density programmable fabric with 118,143 logic elements and approximately 8.3 Mbits of embedded memory for custom digital logic and data buffering.

The device family datasheet documents electrical and switching characteristics—including core and periphery performance, transceiver specifications, and I/O timing—making this part suitable where documented programmable logic, abundant I/O, and embedded memory are required.

Key Features

• High‑density logic  118,143 logic elements to implement complex custom logic, state machines, and control functions.
• Embedded memory  Approximately 8.3 Mbits of on‑chip RAM to support packet buffering, frame storage, and algorithmic data structures.
• I/O capacity  452 general‑purpose I/Os for broad interfacing to external devices, sensors, and parallel or serial peripherals.
• Package and mounting  1152‑BBGA / FCBGA package (supplier package: 1152‑FBGA (35×35)), supplied as a surface‑mount device for board‑level integration.
• Power  Core voltage supply range of 870 mV to 930 mV, enabling defined core power planning and supply design.
• Commercial grade temperature  Rated for 0°C to 85°C operating temperature for standard commercial applications.
• Compliance  RoHS compliant.
• Documentation  Arria II device handbook and device datasheet coverage includes electrical characteristics, switching characteristics, transceiver performance, and I/O timing information.

Typical Applications

• Custom digital logic and prototyping: Use the programmable fabric and abundant logic elements to implement complex processing pipelines and validate custom algorithms in hardware.
• High‑density I/O interfacing: 452 I/Os enable integration with multiple peripherals, sensor arrays, or parallel data paths where flexible pinout and signaling are required.
• Embedded buffering and storage: Approximately 8.3 Mbits of embedded RAM supports buffering, FIFOs, and temporary on‑chip data storage for streaming and packetized data flows.
• Board‑level integration: The 1152‑FBGA surface‑mount package fits compact PCB designs that require a high‑pin‑count, high‑density FPGA solution.

Unique Advantages

• High logic density: Large logic element count enables consolidation of multiple functions into a single device, reducing system BOM and interconnect complexity.
• Substantial on‑chip memory: Approximately 8.3 Mbits of embedded RAM helps minimize external memory requirements for many buffering and temporary storage needs.
• Extensive I/O: 452 I/Os provide flexibility for rich peripheral interfacing and multiple domain connectivity without additional expanders.
• Documented electrical and switching characteristics: The Arria II device handbook and datasheet include core, I/O, and transceiver information to support reliable system design and validation.
• Commercial grade availability: Rated for 0°C to 85°C operation to meet typical commercial‑temperature deployment requirements.
• RoHS compliant: Conforms to environmental regulatory expectations for restricted substances.

Why Choose EP2AGX125EF35C5?

The EP2AGX125EF35C5 delivers a combination of high logic capacity, significant embedded memory, and broad I/O count in a compact 1152‑FBGA surface‑mount package. Its documented device handbook and datasheet provide the electrical and switching details engineers need to design and validate systems leveraging core, periphery, and transceiver capabilities.

This commercial‑grade Arria II GX device is suited to designs that require flexible, high‑density programmable logic and on‑chip memory, with clearly defined supply and temperature parameters to support predictable system integration and verification.

Request a quote or submit a pricing and availability inquiry to receive lead‑time and ordering information for EP2AGX125EF35C5.