EP2AGX125EF35C5N

IC FPGA 452 I/O 1152FBGA
Part Description

Arria II GX Field Programmable Gate Array (FPGA) IC 452 8315904 118143 1152-BBGA, FCBGA

Quantity 1,170 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package1152-FBGA (35x35)GradeCommercialOperating Temperature0°C – 85°C
Package / Case1152-BBGA, FCBGANumber of I/O452Voltage870 mV - 930 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unknown
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs4964Number of Logic Elements/Cells118143
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits8315904

Overview of EP2AGX125EF35C5N – Arria II GX FPGA, 118,143 logic elements, 452 I/Os

The EP2AGX125EF35C5N is an Arria II GX field-programmable gate array (FPGA) from Intel, offered in a 1152-BBGA FCBGA package. It provides a large programmable fabric with 118,143 logic elements and a high I/O count, enabling complex, custom hardware implementations.

Designed for commercial applications, this device delivers substantial on-chip memory and I/O capacity while operating within a core supply range of 870 mV to 930 mV and a commercial temperature range of 0°C to 85°C.

Key Features

  • Logic Capacity  118,143 logic elements for implementing complex digital functions and custom accelerators.
  • Embedded Memory  Approximately 8.3 Mbits of on-chip RAM to support buffering, lookup tables, and state storage.
  • High I/O Count  452 user I/Os to support dense external interfaces and multi-channel connectivity.
  • Package & Mounting  1152-BBGA (FCBGA) package; supplier device package specified as 1152-FBGA (35×35); surface-mount mounting.
  • Power  Core voltage supply specified at 870 mV to 930 mV for core power rails.
  • Commercial Temperature Grade  Rated for 0°C to 85°C operation suitable for commercial deployments.
  • Standards Compliance  RoHS compliant.

Typical Applications

  • High‑density digital processing  Use the large logic fabric and embedded RAM to implement custom datapaths and hardware-accelerated functions.
  • Multi‑interface systems  The 452 I/Os accommodate multiple parallel and serial interfaces for bridging and aggregation tasks.
  • Custom I/O management  Leverage the device’s I/O resources and programmable logic for board-level interface control and protocol handling.

Unique Advantages

  • Substantial programmable fabric: 118,143 logic elements enable complex designs without external ASICs.
  • Significant on-chip memory: Approximately 8.3 Mbits of embedded RAM reduces dependence on external memory for buffering and state storage.
  • High I/O density: 452 I/Os allow flexible connectivity and support for multiple peripherals or high-channel-count systems.
  • Compact, surface-mount package: 1152-BBGA (1152-FBGA, 35×35) provides a high-pin-count solution in a manageable footprint for system integration.
  • Commercial-grade operating window: Rated for 0°C to 85°C and RoHS compliant for mainstream commercial deployments.

Why Choose EP2AGX125EF35C5N?

The EP2AGX125EF35C5N balances large logic capacity, substantial embedded memory, and a high I/O count in a compact FCBGA package, making it a solid choice for commercial designs that require on‑board programmability and flexible interfacing. Its defined core voltage range and commercial temperature rating provide clear electrical and thermal boundaries for system design.

This device is well suited to engineers and procurement teams seeking a capable, RoHS‑compliant Arria II GX FPGA for applications that demand significant programmable logic and I/O density while maintaining standard commercial operating conditions.

If you would like pricing, availability, or to request a quote for EP2AGX125EF35C5N, please submit a quote request or contact sales through your usual procurement channel.

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