EP2AGX125EF35I3G

The EP2AGX125EF35I3G is an Intel Arria II GX field programmable gate array (FPGA) provided in a 1152-BBGA (35×35) surface-mount package. It delivers a large array of reconfigurable logic resources, on-chip memory, and a high I/O count for industrial applications.

With 118,143 logic elements, approximately 8.3 Mbits of embedded memory, 452 I/O pins and an industrial operating temperature range, this FPGA is positioned for designs that require substantial digital logic capacity, significant local memory, and robust environmental tolerance.

Key Features

• Logic Capacity  118,143 logic elements provide substantial programmable logic for complex custom hardware functions and parallel processing within a single device.
• Embedded Memory  Approximately 8.3 Mbits of on-chip RAM to support buffering, state storage, and local data processing without external memory for many use cases.
• I/O Density  452 I/O pins enable broad interfacing to peripherals, sensors, and external subsystems while supporting diverse board-level interconnect requirements.
• Power Supply  Core supply range of 870 mV to 930 mV, suitable for designs targeting this device’s specified operating voltage window.
• Package & Mounting  1152-BBGA FCBGA (supplier package listed as 1152-FBGA, 35×35) in a surface-mount form factor for high-density PCB integration.
• Industrial Grade & Temperature Range  Industrial-grade device with an operating temperature range of −40 °C to 100 °C for reliable operation across a wide range of environmental conditions.
• Environmental Compliance  RoHS compliant, meeting common environmental regulations for lead-free assembly and materials.

Typical Applications

• Industrial Automation  Implement custom control logic, I/O aggregation and protocol handling in factory automation and control systems using the device’s high logic and I/O capacity.
• Embedded Processing  Local buffering and data handling for embedded systems that benefit from substantial on-chip RAM and programmable logic.
• High-Density I/O Designs  Consolidate multiple interfaces or sensor inputs where a high I/O count and reconfigurable logic simplify board-level design.

Unique Advantages

• Large Programmable Fabric: 118,143 logic elements provide headroom for complex logic, parallel tasks, or consolidating multiple functions into a single device.
• Significant On-Chip Memory: Approximately 8.3 Mbits of embedded RAM reduces dependence on external memory for many buffering and state-machine requirements.
• High I/O Count: 452 I/O pins allow extensive connectivity options, reducing the need for external GPIO expanders or additional interface chips.
• Industrial Temperature Range: Rated from −40 °C to 100 °C to support deployment in temperature-challenging industrial environments.
• Compact, High-Density Package: The 1152-BBGA (35×35) surface-mount package enables high-density PCB layouts while maintaining a high pin count.
• Regulatory Compliance: RoHS compliance supports lead-free manufacturing and environmental requirements.

Why Choose EP2AGX125EF35I3G?

The EP2AGX125EF35I3G combines a large programmable logic capacity with substantial embedded memory and a high I/O count in a compact BGA package, making it a practical choice for industrial systems that require flexible, reconfigurable hardware. Its industrial temperature rating and RoHS compliance further support use in production environments with demanding thermal and regulatory constraints.

This device is well suited for engineering teams building complex control, interfacing, or embedded processing solutions that need scalable logic, local memory, and extensive connectivity while maintaining a compact board footprint.

Request a quote or submit an inquiry to get pricing and availability information for EP2AGX125EF35I3G and discuss your application requirements with our team.