EP2AGX125EF29I5

The EP2AGX125EF29I5 is an industrial-grade Arria II GX field programmable gate array (FPGA) from Intel. It delivers a combination of programmable logic capacity, on-chip embedded memory, and a high I/O count for complex, flexible system designs.

Designed for surface-mount deployment in a 780-FBGA (29×29) package, this device supports a core supply range of 870 mV to 930 mV and an operating temperature range of −40 °C to 100 °C, making it suitable for industrial environments that require robust, reconfigurable logic.

Key Features

• Logic Capacity  Provides 118,143 logic elements to implement complex programmable logic and custom digital functions.
• Embedded Memory  Includes approximately 8.32 Mbits of on-chip RAM for buffering, lookup tables, and state storage.
• I/O Resources  Offers 372 general-purpose I/Os to support broad interfacing needs across peripherals and subsystems.
• Package & Mounting  780-BBGA / 780-FBGA (29×29) FCBGA package optimized for surface-mount assembly.
• Power Supply  Core voltage supply operating range from 870 mV to 930 mV for core power planning.
• Industrial Temperature Range  Rated for operation from −40 °C to 100 °C to meet industrial-temperature requirements.
• Regulatory  RoHS compliant for environmental and manufacturing compliance.

Typical Applications

• Industrial control and automation  Programmable logic and abundant I/O allow implementation of motor control, PLC functions, and sensor aggregation within industrial temperature ranges.
• Communications equipment  Logic capacity and on-chip memory enable packet processing and protocol handling where flexible, reconfigurable logic is required.
• Imaging and test systems  High I/O count and sizable embedded RAM support interfacing with sensors and buffering image or measurement data.
• Custom digital systems and prototyping  Use the FPGA’s logic and memory resources to prototype or deploy bespoke digital functions and interfaces.

Unique Advantages

• High logic density: 118,143 logic elements provide ample resources for large-scale custom logic implementations.
• Substantial on-chip memory: Approximately 8.32 Mbits of embedded RAM for local buffering, lookup tables, and state machines reduces external memory dependence.
• Extensive I/O: 372 I/Os simplify system integration by supporting many peripherals and parallel interfaces without extensive external glue logic.
• Industrial-grade operation: Rated from −40 °C to 100 °C to support demanding deployment environments.
• Compact BGA footprint: 780-FBGA (29×29) surface-mount package enables high-density board designs while maintaining serviceable I/O counts.
• Low-voltage core: Core supply range of 870 mV to 930 mV supports modern low-voltage power architectures.

Why Choose EP2AGX125EF29I5?

The EP2AGX125EF29I5 positions itself as a flexible, industrial-grade FPGA option where substantial logic capacity, embedded memory, and a large number of I/Os are required. Its package, temperature rating, and RoHS compliance make it suitable for production deployment in industrial and communications equipment.

This device is appropriate for engineering teams building reconfigurable digital systems that need on-chip resources to reduce BOM complexity and enable adaptable designs. Detailed device-level documentation is available in the Arria II device datasheet to support design and qualification efforts.

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