EP2AGX125EF29I3N

The EP2AGX125EF29I3N is an Intel Arria II GX field-programmable gate array (FPGA) supplied in a 780-ball BGA (FCBGA) package. It provides a large programmable fabric with 118,143 logic elements, substantial embedded memory, and a high I/O count for complex, configurable digital designs.

Designed for industrial-grade applications, this device combines on-chip resources and I/O density to address demanding embedded systems, communications interfaces, and data processing tasks where programmable logic and robust operating range are required.

Key Features

• Logic Capacity  118,143 logic elements for complex logic integration and multi-function designs.
• Embedded Memory  Approximately 8.3 Mbits of on-chip RAM to support buffers, FIFOs, and local data storage without external memory.
• I/O Density  372 user I/O pins to support wide parallel buses, multiple interfaces, and mixed-signal I/O arrangements.
• Transceiver and Interface Support  Arria II GX family documentation includes transceiver and PCI Express (PIPE) high-performance interface blocks for high-bandwidth serial communication (refer to device datasheet for details).
• Package and Assembly  780-ball BGA, FCBGA form factor (supplier package: 780-FBGA, 29×29) optimized for surface-mount assembly and compact board layouts.
• Power  Core supply range specified at 870 mV to 930 mV to match system power delivery requirements.
• Industrial Temperature Rating  Operates from –40 °C to 100 °C, suitable for industrial environments.
• Regulatory  RoHS compliant for global electronics manufacturing and environmental standards.

Typical Applications

• High-performance embedded systems  Use the large logic capacity and on-chip memory to implement custom processing blocks, control logic, and system glue in embedded platforms.
• Network and communications equipment  Leverage the Arria II GX transceiver support and high I/O count for packet processing, interface bridging, and protocol implementation.
• Industrial automation and control  Industrial temperature grade and robust I/O density make this FPGA suitable for motor control, sensor aggregation, and real-time control systems.

Unique Advantages

• Substantial logic resources: 118,143 logic elements allow integration of complex functions on a single device, reducing external components and board complexity.
• Significant on-chip memory: Approximately 8.3 Mbits of embedded RAM reduces dependence on external memory for buffering and accelerates data-path designs.
• High I/O count: 372 I/O pins enable flexible interfacing to peripherals, parallel buses, and mixed-signal front ends without external multiplexing.
• Industrial operating range: –40 °C to 100 °C rating supports deployments in harsh and temperature-variable industrial environments.
• Compact BGA package: 780-ball FCBGA (29×29) provides a dense, board-friendly footprint for space-constrained systems.
• Standards-aware documentation: Device handbook and datasheet include electrical characteristics, transceiver performance specifications, and I/O timing guidance to support system integration and validation.

Why Choose EP2AGX125EF29I3N?

The EP2AGX125EF29I3N delivers a balanced combination of logic density, embedded memory, and I/O capacity in an industrial-grade Arria II GX FPGA package. Its specifications suit designs that require significant on-chip resources and robust operating conditions while maintaining a compact board footprint.

Engineers and procurement teams looking to consolidate functionality, reduce BOM count, and support industrial deployment conditions will find this device appropriate for mid-to-high complexity implementations where programmable flexibility and documented interface capabilities matter.

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