EP2AGX125EF29I5G
| Part Description |
Arria II GX Field Programmable Gate Array (FPGA) IC 372 8315904 118143 780-BBGA, FCBGA |
|---|---|
| Quantity | 1,692 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 26 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 780-FBGA (29x29) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 780-BBGA, FCBGA | Number of I/O | 372 | Voltage | 870 mV - 930 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 4964 | Number of Logic Elements/Cells | 118143 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 8315904 |
Overview of EP2AGX125EF29I5G – Arria II GX Field Programmable Gate Array (FPGA), 780‑FBGA (29×29), Industrial
The EP2AGX125EF29I5G is an Intel Arria II GX FPGA in a 780‑ball FCBGA package designed for industrial applications. It pairs a 40‑nm, low‑power programmable logic engine with high‑performance DSP and transceiver capabilities to address demanding communication, signal processing, and system integration tasks.
With 118,143 logic elements, approximately 8.3 Mbits of embedded memory, and 372 user I/Os, this device targets designs requiring substantial logic density, on‑chip memory, and a range of serial and parallel interfaces. The device is RoHS‑compliant and rated for operation from −40 °C to 100 °C with a core supply range of 870 mV to 930 mV.
Key Features
- Logic Capacity 118,143 logic elements to implement complex control, datapath, and custom accelerator functions.
- Embedded Memory Approximately 8.3 Mbits of on‑chip RAM for FIFOs, buffers, and state storage.
- DSP and Arithmetic High‑performance DSP blocks (documented up to 550 MHz) with configurable multipliers and hardened adder/accumulator functions for signal processing and numeric workloads.
- High‑Speed Transceivers Support for up to 24 full‑duplex CDR‑based transceivers with data rates between 600 Mbps and 6.375 Gbps, enabling a wide range of serial protocols and high‑bandwidth links.
- I/O and Interface Flexibility 372 user I/Os with support for numerous single‑ended and differential standards, LVDS SERDES, and on‑chip termination options for simplified board integration.
- Programmable Logic Architecture 40‑nm device technology with adaptive logic modules (ALMs) and eight‑input fracturable LUTs for efficient logic packing and performance.
- Package and Assembly 780‑FBGA (29×29) surface‑mount FCBGA package suitable for compact, board‑level deployments in industrial systems.
- Operating and Power Industrial temperature range of −40 °C to 100 °C and a documented core supply window of 870 mV to 930 mV to support stable operation across environments.
- Compliance RoHS‑compliant manufacturing to meet environmental and regulatory preferences.
Typical Applications
- Telecommunications and Networking Implements high‑bandwidth serial interfaces and protocol handling using integrated transceivers and programmable logic for switches, routers, and fronthaul equipment.
- Signal Processing and DSP Acceleration Performs real‑time filtering, FFTs, and other numeric workloads using dedicated DSP blocks and on‑chip memory for low‑latency processing.
- Storage and Host Interfaces Implements physical and link‑layer functionality for PCIe, SATA/SAS, and related storage interfaces leveraging hard IP and transceiver support.
- Video and Broadcast Systems Supports SD/HD/3G/ASI SDI and related serial protocols for video transport and processing thanks to high‑speed SERDES and timing resources.
Unique Advantages
- High Logic Density: 118,143 logic elements enable integration of multiple subsystems and complex custom logic into a single FPGA, reducing BOM count.
- Integrated Memory Resources: Approximately 8.3 Mbits of embedded RAM provides on‑chip storage for buffering and packet handling without external memory overhead.
- Flexible High‑Speed I/O: 372 I/Os and up to 24 transceivers covering 600 Mbps–6.375 Gbps support diverse serial and parallel interfaces to simplify board‑level design.
- DSP‑Oriented Architecture: Dedicated DSP blocks and configurable multipliers accelerate signal and numeric processing tasks, enabling higher throughput for compute‑intensive functions.
- Industrial Reliability: Rated for −40 °C to 100 °C operation and delivered in a robust 780‑FBGA package suitable for industrial use cases.
- Software and IP Ecosystem: Designed for use with the Arria II family design flows and IP (as documented in the device handbook), easing integration of common interfaces and peripherals.
Why Choose EP2AGX125EF29I5G?
The EP2AGX125EF29I5G positions itself as a balanced solution for industrial systems that require substantial programmable logic, embedded memory, and high‑speed serial connectivity in a compact FCBGA package. Its Arria II family architecture combines ALM‑based logic efficiency with dedicated DSP and transceiver resources to address communications, signal processing, and interface integration challenges.
This device is well suited for engineers and system designers who need scalable logic capacity, on‑chip memory, and flexible I/O while maintaining industrial temperature operation and RoHS compliance. The Arria II device handbook and family IP support help streamline development and integration into complex system designs.
Request a quote or submit a pricing inquiry to evaluate EP2AGX125EF29I5G for your next design project.

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