EP2AGX190EF29C6N

The EP2AGX190EF29C6N is an Arria II GX family FPGA from Intel, delivered in a 780-ball FCBGA (29×29) package for surface-mount applications. It provides a large programmable fabric with substantial embedded memory and a high I/O count for complex digital designs.

With 181,165 logic elements and approximately 10 Mbits of on-chip RAM, this commercial-grade device is suited to designs that require dense logic integration, significant local buffering, and broad I/O connectivity while operating within a 0 °C to 85 °C temperature range and a core supply of 870 mV to 930 mV.

Key Features

• Large Logic Capacity — 181,165 logic elements to implement extensive combinational and sequential logic.
• Embedded Memory — Approximately 10 Mbits of on-chip RAM for local buffering, FIFOs, and storage of intermediate data.
• High I/O Count — 372 device I/Os to support wide parallel interfaces and dense system connectivity.
• Package and Mounting — 780-ball FCBGA (29×29) package optimized for surface-mount PCB assembly in compact system layouts.
• Power — Core operating supply range from 870 mV to 930 mV to match system power-rail design requirements.
• Commercial Grade & Compliance — Commercial-grade device rated for 0 °C to 85 °C and RoHS compliant for modern regulatory requirements.

Typical Applications

• High-density digital processing — Implement complex state machines, large combinational logic blocks, and protocol engines using the device’s extensive logic resources.
• Embedded memory buffering — Use the approximately 10 Mbits of embedded RAM for packet buffering, frame storage, or temporary data staging close to logic.
• Multi-channel I/O systems — Leverage 372 I/Os to interface with wide parallel buses, sensor arrays, or multiple peripheral channels.

Unique Advantages

• Dense programmable fabric: 181,165 logic elements provide the capacity to consolidate multiple functions into a single FPGA, reducing board-level component count.
• Significant on-chip memory: Approximately 10 Mbits of RAM lowers dependence on external memory for many buffering and staging tasks, simplifying PCB design and improving latency.
• Broad I/O flexibility: 372 I/Os enable flexible partitioning of interfaces and support for complex multi-interface systems without immediate need for external multiplexing.
• Compact surface-mount package: The 780-ball FCBGA (29×29) package balances high pin count with a compact footprint for space-constrained designs.
• Standards-conscious supply and thermal range: Defined core voltage range (870 mV–930 mV) and commercial temperature rating help align system power and thermal design decisions.
• Regulatory compliance: RoHS compliance supports environmental and manufacturing requirements for modern electronics production.

Why Choose EP2AGX190EF29C6N?

The EP2AGX190EF29C6N positions itself as a high-capacity Arria II GX FPGA option for designs that demand a large logic fabric, substantial embedded memory, and extensive I/O connectivity in a compact surface-mount package. Its commercial-grade rating and defined core voltage range allow predictable integration into board-level systems operating within standard environmental conditions.

Backed by the Arria II device documentation from Intel, this part is suitable for teams aiming to consolidate functionality, reduce BOM complexity, and leverage a dense programmable solution for moderate-temperature commercial applications.

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