EP2AGX125EF29C5G

IC FPGA 372 I/O 780FBGA
Part Description

Arria II GX Field Programmable Gate Array (FPGA) IC 372 8315904 118143 780-BBGA, FCBGA

Quantity 154 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time26 Weeks
Datasheet

Specifications & Environmental

Device Package780-FBGA (29x29)GradeCommercialOperating Temperature0°C – 85°C
Package / Case780-BBGA, FCBGANumber of I/O372Voltage870 mV - 930 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs4964Number of Logic Elements/Cells118143
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits8315904

Overview of EP2AGX125EF29C5G – Arria II GX FPGA, 780‑BBGA FCBGA

The EP2AGX125EF29C5G is an Arria II GX field-programmable gate array in a 780‑BBGA (29×29) FCBGA package designed for surface-mount assembly. It delivers a mid-to-high logic capacity FPGA with integrated memory and transceiver-capable architecture suitable for commercial applications requiring programmable logic, embedded memory, and multi‑Gbps serial interfaces.

Built on the Arria II device family architecture, this device targets use cases in communications, data acquisition, high-bandwidth interfaces, and DSP-accelerated processing where a combination of logic density, embedded RAM, and configurable high-speed I/O is required.

Key Features

  • Core Architecture 40‑nm low‑power Arria II FPGA architecture with adaptive logic modules and an eight‑input fracturable LUT for efficient logic implementation.
  • Logic Capacity Approximately 118,143 logic elements to support medium-to-large programmable logic designs.
  • Embedded Memory Approximately 8.3 Mbits of on‑chip RAM for FIFOs, buffering, and local data storage.
  • DSP and Arithmetic Blocks Dedicated DSP blocks (documented up to 550 MHz) with configurable multipliers (9×9, 12×12, 18×18, 36×36 and 18×36 modes) and hardcoded add/subtract/accumulate functions for signal processing tasks.
  • High‑Speed Transceivers & Interfaces Arria II family transceiver capabilities include support up to 6.375 Gbps and common serial protocols (PCIe, Ethernet, SATA, etc.) for high‑bandwidth system I/O (family-level feature set referenced in the device handbook).
  • I/O and Packaging 372 user I/Os in a 780‑BBGA surface‑mount package (29×29 mm supplier package), enabling extensive board-level connectivity.
  • Power and Supply Low‑power device characteristics with a documented core supply voltage range of 0.870 V to 0.930 V.
  • Commercial Grade and Environmental Commercial temperature grade with an operating range of 0 °C to 85 °C and RoHS compliance.

Typical Applications

  • Networking & Telecom Implement protocol layers and high‑speed serial links for Ethernet, PCIe, and similar interfaces using the Arria II family transceiver and PHY features.
  • High‑Speed Data Acquisition Use the DSP blocks and on‑chip RAM for front‑end processing, buffering, and real‑time data handling in instrumentation and measurement systems.
  • Storage & Connectivity Support storage interfaces and controllers leveraging the device’s serial protocol support and programmable logic for custom I/O and protocol offload.
  • Prototyping and Embedded Systems Provide programmable acceleration, glue logic, and custom peripherals in commercial embedded designs.

Unique Advantages

  • Balanced Logic and Memory Resource Mix: ~118k logic elements paired with ~8.3 Mbits of embedded RAM gives designers room for both combinational logic and local storage without external memory for many functions.
  • Dedicated DSP Capability: On‑device DSP blocks and configurable multipliers shorten development time for signal processing tasks and reduce the need for external accelerators.
  • High‑Speed Serial Support (Family-Level): Arria II family transceiver features enable implementation of multi‑Gbps links and protocol interfaces, easing integration of high‑bandwidth I/O.
  • Compact, Surface‑Mount Packaging: 780‑BBGA (29×29) FCBGA package provides high I/O density in a surface‑mount form factor suitable for space‑constrained commercial PCBs.
  • Power‑Aware Operation: Low‑power 40‑nm design with a defined core voltage range (0.870–0.930 V) supports power‑sensitive applications and predictable supply design.

Why Choose EP2AGX125EF29C5G?

The EP2AGX125EF29C5G combines the Arria II GX family’s 40‑nm low‑power architecture with a substantial logic element count and meaningful embedded memory capacity, making it a practical choice for commercial applications that need programmable logic, on‑chip RAM, and DSP acceleration. Its surface‑mount 780‑BBGA package and 372 I/O pins provide flexible board integration for high‑connectivity designs.

This device suits engineering teams building commercial communications equipment, data acquisition systems, storage controllers, and embedded platforms that leverage the Arria II family feature set for multi‑Gbps serial interfaces and DSP workloads while maintaining predictable supply and thermal requirements within the 0 °C to 85 °C operating range.

Request a quote or submit an inquiry to receive pricing and availability details for EP2AGX125EF29C5G.

Request a Quote

















    No file selected



    Our team will respond within 24 hours.


    I agree to receive newsletters and promotional emails. I can unsubscribe at any time.

    Certifications and Membership
    NQA AS9100 CMYK ANAB
    NQA AS9100 ANAB Badge
    ESD2020 Badge
    ESD2020 Association Badge
    GIDEP Badge
    GIDEP Badge
    Suntsu ERAI MemberVerification
    Suntsu ERAI Member Verification
    Available Shipping Methods
    FedEx
    UPS
    DHL
    Accepted Payment Methods
    American Express
    American Express
    Discover
    Discover
    MasterCard
    MasterCard
    Visa
    Visa
    UnionPay
    UnionPay

    Date Founded: 1968


    Headquarters: Santa Clara, California, USA


    Employees: 130,000+


    Revenue: $54.23 Billion


    Certifications and Memberships: ISO9001:2015, ISO14001:2015, ISO17025:2017, ISO27001:2022, ISO45001:2018, ISO50001:2018


    Featured Products
    Latest News
    keyboard_arrow_up