EP2AGX125EF29C5

The EP2AGX125EF29C5 is an Arria II GX family FPGA offered in a 780-ball FCBGA package targeted for commercial applications. It delivers a high logic capacity and substantial on-chip memory within a compact surface-mount BGA footprint, making it suitable for designs that require dense programmable logic and significant embedded RAM resources.

As part of the Arria II device family, the device is documented in the Arria II Device Handbook, which describes the family’s electrical and switching characteristics, including core and periphery performance and transceiver-related specifications.

Key Features

• Logic Capacity — 118,143 logic elements to implement complex digital functions and large-scale programmable designs.
• Embedded Memory — Approximately 8.32 Mbits of on-chip RAM for buffering, data storage, and algorithm acceleration within the FPGA fabric.
• I/O Density — 372 user I/O pins for broad interfacing options to peripherals, sensors, and external logic.
• Core Voltage — Core supply range of 870 mV to 930 mV enabling standard Arria II GX core operation.
• Package and Mounting — 780-ball BGA (FCBGA) package; supplier device package 780-FBGA (29×29); surface-mount for PCB assembly.
• Operating Temperature — Commercial grade rated from 0 °C to 85 °C for standard temperature environments.
• Regulatory Compliance — RoHS compliant.

Typical Applications

• High-density digital logic — Implement complex state machines, datapaths, and custom processing pipelines using the device’s 118,143 logic elements.
• Memory-intensive designs — Use the approximately 8.32 Mbits of embedded RAM for data buffering, packet storage, or local lookup tables.
• Multi-interface systems — Leverage 372 I/Os to connect multiple external devices, sensors, or parallel/serial interfaces within a single FPGA.

Unique Advantages

• High logic density: 118,143 logic elements provide the fabric capacity needed for feature-rich FPGA designs.
• Substantial embedded RAM: Approximately 8.32 Mbits of on-chip memory reduces dependence on external memory for many data-centric functions.
• Generous I/O count: 372 I/Os support extensive peripheral connectivity without requiring additional bridge components.
• Compact BGA package: 780-ball FCBGA (29×29) enables high-pin-count integration in a space-efficient surface-mount package.
• Commercial-grade rating: Specified for 0 °C to 85 °C operation to match standard commercial deployment environments.
• RoHS compliant: Meets common environmental compliance expectations for commercial electronics.

Why Choose EP2AGX125EF29C5?

The EP2AGX125EF29C5 positions itself as a high-capacity Arria II GX FPGA option for commercial designs requiring a combination of large programmable logic resources, substantial embedded memory, and extensive I/O. Its 780-ball BGA packaging and surface-mount mounting support compact, high-density PCB implementations while the documented Arria II device handbook provides the family-level electrical and switching guidance designers expect.

This device is well suited for customers building complex digital systems that need integrated RAM and plentiful I/O in a commercially rated FPGA platform, offering a balance of capacity, integration, and documented device characteristics.

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