EP2AGX125EF29C4G

The EP2AGX125EF29C4G is an Intel Arria II GX field programmable gate array (FPGA) supplied in a 780-BBGA FCBGA package. It provides a high count of programmable logic, embedded memory, and a large I/O complement for commercial FPGA-based designs.

This device is intended for commercial applications that require configurable logic, substantial on-chip memory, and flexible I/O within a compact surface-mount BGA footprint.

Key Features

• Core Logic — 118,143 logic elements for implementing complex programmable logic and custom hardware functions.
• Embedded Memory — Approximately 8.32 Mbits of on-chip RAM to support buffering, packet storage, and state machines.
• I/O Density — 372 user I/O pins to support wide parallel interfaces and multiple external connections.
• Power — Operates from a supply range of 870 mV to 930 mV, supporting target system power rails.
• Package & Mounting — 780-BBGA (780-FBGA, 29×29) package in a surface-mount form factor for compact board integration.
• Temperature & Grade — Commercial grade with an operating range of 0°C to 85°C.
• Environmental Compliance — RoHS compliant.

Typical Applications

• Commercial embedded systems — Implement custom control logic and system glue in compact boards where programmable logic and on-chip RAM are required.
• Prototyping and hardware integration — Rapidly iterate hardware designs using the device’s large logic capacity and significant embedded memory.
• I/O-intensive control — Handle multiple parallel interfaces or sensor/control channels using the device’s 372 I/O pins.

Unique Advantages

• High logic capacity: 118,143 logic elements enable substantial custom logic integration without immediate external ASIC development.
• Substantial on-chip RAM: Approximately 8.32 Mbits of embedded memory reduces dependence on external memory for many buffering and state-storage tasks.
• Generous I/O count: 372 I/O pins provide flexibility for interfacing to peripherals, parallel buses, and multiple domain signals.
• Compact BGA package: 780-BBGA (29×29) delivers high density in a surface-mount package suitable for space-constrained PCBs.
• Commercial operating range: 0°C to 85°C and RoHS compliance support deployment in a wide range of commercial products.

Why Choose EP2AGX125EF29C4G?

The EP2AGX125EF29C4G balances high logic density, meaningful embedded memory, and broad I/O capacity in a compact 780-BBGA surface-mount package. Its specifications suit engineers designing commercial systems that require configurable hardware, on-chip storage, and flexible interfacing while maintaining RoHS compliance.

This Arria II GX device is well suited to teams and projects that need a scalable, programmable-platform building block for prototyping, integration, and mid-volume commercial deployments.

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