EP2AGX125DF25I5NAA

The EP2AGX125DF25I5NAA is an Intel Arria II GX Field Programmable Gate Array (FPGA) supplied in a 572-ball FCBGA package. It delivers high digital integration with 118,143 logic elements, approximately 8.316 Mbits of embedded memory and 260 user I/O, packaged for surface-mount assembly.

Built for industrial temperature operation and low-voltage core operation, this device targets designs that require substantial on-chip logic and memory capacity within a compact BGA footprint.

Key Features

• Core Logic  118,143 logic elements for implementing complex, high-density digital designs.
• Embedded Memory  Approximately 8.316 Mbits of on-chip RAM to support buffering, state storage and local data processing.
• I/O  260 user I/O pins to connect peripherals, interfaces and external devices directly to the FPGA fabric.
• Power  Core voltage supply range of 870 mV to 930 mV for compatibility with low-voltage system architectures.
• Package & Mounting  572-BGA, FCBGA package (supplier device package: 572-FBGA, FC (25x25)) in a surface-mount form factor for dense PCB implementations.
• Temperature & Grade  Industrial grade device rated for operation from -40 °C to 100 °C for use in temperature-demanding environments.

Typical Applications

• Industrial control systems  Industrial-grade temperature range and plentiful I/O make the FPGA suitable for control logic, sensor interfacing and real-time processing in factory and automation equipment.
• High-density digital subsystems  Large logic capacity and significant on-chip RAM enable integration of complex state machines, custom accelerators and glue logic for system consolidation.
• Communications and I/O aggregation  260 I/O pins and sizable local memory support protocol bridging, interface aggregation and buffering roles in communications hardware.

Unique Advantages

• High logic density: 118,143 logic elements allow implementation of large, complex digital designs on a single device.
• Substantial embedded memory: Approximately 8.316 Mbits of on-chip RAM reduces dependence on external memory for many buffering and state-storage needs.
• Generous I/O count: 260 user I/O pins simplify connectivity to sensors, transceivers and peripheral devices without extensive external glue logic.
• Industrial-ready operation: Rated for -40 °C to 100 °C, supporting deployment in temperature-challenging environments.
• Compact surface-mount package: 572-BGA FCBGA packaging provides a high-density footprint for space-constrained PCBs.
• Low-voltage core support: Operates from 870 mV to 930 mV to align with modern low-voltage system rails.

Why Choose EP2AGX125DF25I5NAA?

The EP2AGX125DF25I5NAA balances large programmable logic resources, significant on-chip RAM and a broad I/O count in a surface-mount 572-BGA package, making it a strong fit for industrial and high-density digital designs. Its industrial temperature rating and low-voltage core range support reliable operation in demanding environments while enabling integration and consolidation of system functions.

This device is suited to engineering teams needing substantial logic capacity and embedded memory in a compact package, offering long-term value through integration that can reduce board-level complexity and external component count.

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