EP2A70B724C9

The EP2A70B724C9 is an APEX II family Field Programmable Gate Array (FPGA) in a 724-ball BGA (FCBGA) package. It delivers substantial programmable logic and on-chip memory with a high I/O count for complex, board-level digital designs.

Built for commercial-grade applications, this device provides 67,200 logic elements, approximately 1.15 Mbits of embedded memory, and up to 540 I/O pins, while operating from a 1.425 V to 1.575 V core supply and across a 0 °C to 85 °C temperature range.

Key Features

• Logic Resources  67,200 logic elements enabling implementation of large-scale custom logic, state machines, and datapaths.
• Embedded Memory  Approximately 1.15 Mbits of on-chip RAM to support buffering, FIFOs, and local data storage without external memory.
• I/O Capacity  540 available I/O pins to interface with high-pin-count peripherals and multiple parallel buses.
• Gate Count  Approximately 5,250,000 gates to represent device complexity and integration capability.
• Power and Voltage  Core supply range of 1.425 V to 1.575 V for defined power budgeting and system design.
• Package and Mounting  724-BBGA (FCBGA) 35×35 supplier device package optimized for surface-mount PCB assembly.
• Commercial Grade Temperature  Rated for operation from 0 °C to 85 °C to suit standard commercial environments.
• RoHS Compliant  Manufactured in compliance with RoHS requirements.

Typical Applications

• Custom programmable logic  Implement large combinational and sequential logic blocks where up to 67,200 logic elements and embedded RAM are required.
• High-density I/O interfacing  Designs that require many parallel interfaces or multiple peripheral connections can leverage the device’s 540 I/O pins.
• On-chip data buffering  Use the approximately 1.15 Mbits of embedded memory for local buffering, FIFOs, and temporary storage to reduce external memory needs.

Unique Advantages

• High logic capacity: 67,200 logic elements provide the headroom needed for complex custom logic and multi-function designs.
• Substantial on-chip memory: Approximately 1.15 Mbits of embedded RAM reduces reliance on external memory and simplifies board-level BOM.
• Extensive I/O: 540 I/O pins enable dense peripheral connectivity and multiple parallel interfaces without external I/O expanders.
• Defined power window: A narrow core voltage range (1.425 V–1.575 V) helps with predictable power-supply design and margining.
• Compact, surface-mount package: 724-BBGA (35×35) package supports high-density PCB layouts while maintaining a proven BGA mounting approach.
• Commercial grade: Operation across 0 °C to 85 °C matches standard commercial deployment and system validation profiles.

Why Choose EP2A70B724C9?

The EP2A70B724C9 balances large-scale programmable logic, substantial embedded memory, and a high I/O count in a single commercial-grade FPGA package. Its combination of 67,200 logic elements, approximately 1.15 Mbits of on-chip RAM, and 540 I/Os makes it suited to board-level designs that require both integration density and flexible interfacing.

Choose this FPGA for designs where predictable power requirements, significant logic and memory resources, and a compact FCBGA footprint provide long-term design scalability and simplified BOM management.

Request a quote or submit a product inquiry to obtain pricing, availability, and ordering details for the EP2A70B724C9.