EP2A70B724C8

The EP2A70B724C8 is an Altera APEX II field programmable gate array (FPGA) offered in a 724-BBGA FCBGA package. It provides a high logic capacity and substantial on-chip memory along with a large number of I/O pins, making it suitable for designs that require dense digital integration and significant on-chip resources.

This device operates from a 1.425 V to 1.575 V supply and supports commercial temperature operation from 0 °C to 85 °C, and is RoHS compliant.

Key Features

• Core Logic 67,200 logic elements providing a total of 5,250,000 gates for implementing complex custom logic and control functions.
• Embedded Memory Approximately 1.15 Mbits of on-chip RAM for buffering, state storage, and small data tables.
• I/O Capacity 540 I/O pins to support multiple parallel interfaces, bus connections, and board-level integration.
• Package 724-BBGA (FCBGA) package, supplier device package indicated as 724-BGA (35×35), suitable for surface-mount PCB assembly.
• Power Nominal supply voltage range of 1.425 V to 1.575 V for core operation.
• Operating Range Commercial temperature grade with specified operation from 0 °C to 85 °C.
• Regulatory RoHS compliant.

Typical Applications

• High-density I/O systems — 540 I/Os enable complex board-level interfacing and multiple parallel data paths without extensive external glue logic.
• Logic- and gate-intensive designs — 67,200 logic elements and 5,250,000 gates provide capacity for large custom digital functions and control logic.
• Embedded buffering and control — approximately 1.15 Mbits of on-chip RAM supports packet buffering, state machines, and local data storage.

Unique Advantages

• High logic density: 67,200 logic elements enable consolidation of multiple functions into a single FPGA, reducing component count.
• Substantial on-chip memory: Approximately 1.15 Mbits of RAM helps minimize external memory needs for moderate buffering and storage requirements.
• Extensive I/O availability: 540 I/Os allow flexible interfacing to peripherals, sensors, and parallel buses.
• Compact surface-mount package: 724-BBGA (35×35) FCBGA package supports high-density PCB layouts while maintaining robust signal routing.
• Commercial temperature suitability: Rated for 0 °C to 85 °C operation for typical commercial applications.
• RoHS compliant: Conforms to RoHS requirements for lead-free assembly.

Why Choose EP2A70B724C8?

The EP2A70B724C8 APEX II FPGA delivers a balanced combination of high logic capacity, substantial on-chip RAM, and a large I/O count in a compact 724-BBGA FCBGA package. These characteristics make it a practical choice for designs that need significant programmable logic and local memory while maintaining a high pin count for board-level connectivity.

Manufactured by Altera and specified for commercial temperature operation with RoHS compliance, this device is suited for engineering teams looking to consolidate functionality, reduce external components, and maintain a predictable supply-voltage and thermal envelope.

Request a quote or submit a pricing inquiry to evaluate EP2A70B724C8 for your next design and receive application-specific availability and lead-time information.