EP4CE115F29I8LN

The EP4CE115F29I8LN is an Intel Cyclone® IV E Field Programmable Gate Array (FPGA) packaged in a 780-FBGA (29×29) surface-mount format. It provides 114,480 logic elements and approximately 3.98 Mbits of embedded memory, combined with a high I/O count to support complex, configurable digital designs.

Designed for industrial environments, the device supports a core supply range of 0.97 V to 1.03 V and an operating temperature range of −40 °C to 100 °C, making it suitable for deployments that require extended temperature tolerance and substantial integration density.

Key Features

• FPGA Core Architecture  Cyclone IV E FPGA family from Intel, offering a programmable logic fabric for custom digital implementations.
• Logic Capacity  114,480 logic elements to implement large combinational and sequential logic networks.
• Embedded Memory  Approximately 3.98 Mbits of on-chip RAM (3,981,312 total bits) for data buffering, FIFOs, and state storage.
• I/O Density  528 user I/O pins to support wide parallel interfaces and multiple peripheral connections.
• Power and Voltage  Core voltage supply specified from 0.97 V to 1.03 V to align with system power rails and design constraints.
• Package & Mounting  780-FBGA (29×29) supplier device package in a 780-ball BGA format; surface-mount mounting type for high-density board designs.
• Industrial Temperature Grade  Rated for operation from −40 °C to 100 °C and specified as Industrial grade for temperature-critical applications.
• Regulatory Compliance  RoHS compliant to meet environmental and manufacturing requirements.

Unique Advantages

• High logic density: 114,480 logic elements provide the capacity to consolidate multiple functions into a single FPGA, reducing component count and board complexity.
• Substantial on-chip memory: Approximately 3.98 Mbits of embedded RAM allows local data storage for buffering, packet queues, and state machines without external memory.
• Large I/O complement: 528 I/Os enable broad interfacing options for parallel buses, sensors, peripherals, and system-level connectivity.
• Industrial temperature range: −40 °C to 100 °C operation supports deployment in demanding environmental conditions.
• Compact BGA package: The 780-FBGA (29×29) package supports high-pin-count designs in a compact, surface-mount form factor for space-constrained PCBs.
• Environmentally compliant: RoHS compliance simplifies adoption in regulated manufacturing processes.

Why Choose EP4CE115F29I8LN?

The EP4CE115F29I8LN positions itself as a high-capacity, industrial-grade Cyclone IV E FPGA suitable for system designs that require large programmable logic resources, substantial on-chip memory, and extensive I/O in a compact BGA package. Its specified core voltage range and wide operating temperature window make it a practical choice for engineering teams focused on scalable, rugged digital solutions.

With verified specifications for logic elements, embedded RAM, I/O count, package, and industrial temperature rating, this device offers a clear, quantifiable platform for integrating complex control, processing, and interface functions into a single programmable component.

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