EP4CE115F29I7N
| Part Description |
Cyclone® IV E Field Programmable Gate Array (FPGA) IC 528 3981312 114480 780-BGA |
|---|---|
| Quantity | 7 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 16 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 780-FBGA (29x29) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 780-BGA | Number of I/O | 528 | Voltage | 1.15 V - 1.25 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 7155 | Number of Logic Elements/Cells | 114480 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 3981312 |
Overview of EP4CE115F29I7N – Cyclone® IV Field Programmable Gate Array (FPGA) 780-FBGA
The EP4CE115F29I7N is an Intel Cyclone® IV FPGA supplied in a 780-FBGA (29×29) package, designed for industrial-grade programmable logic applications. It delivers a substantial logic capacity with 114,480 logic elements, approximately 3.98 Mbits of embedded memory, and 528 I/O pins to support complex, high‑I/O designs.
With a core supply range of 1.15 V to 1.25 V and an operating temperature range of −40 °C to 100 °C, this device targets industrial and embedded systems that require scalable programmable logic, dense I/O, and on‑chip memory in a compact surface‑mount BGA package.
Key Features
- Core Logic 114,480 logic elements provide substantial capacity for mid‑to‑large FPGA designs and flexible implementation of custom logic functions.
- Embedded Memory Approximately 3.98 Mbits of on‑chip RAM to store data, buffers, and state machines without external memory for many use cases.
- I/O Connectivity 528 I/O pins support broad external interfacing options in a single device, enabling dense peripheral and bus connectivity.
- Package and Mounting 780‑FBGA (29×29) surface‑mount package provides a compact footprint for board-level integration while supporting a high pin count.
- Power Core supply range of 1.15 V to 1.25 V allows designers to plan power delivery and thermal budgets precisely.
- Industrial Temperature Range Rated for operation from −40 °C to 100 °C, suitable for industrial environments that require extended temperature tolerance.
- Compliance RoHS‑compliant construction supports regulatory and manufacturing requirements for lead‑free assembly.
Typical Applications
- Industrial Automation Implement control logic, sensor aggregation, and protocol bridging using the device’s large logic capacity and wide operating temperature range.
- Embedded Systems Use on‑chip RAM and abundant I/O to integrate custom interfaces, real‑time processing, and peripheral control in compact embedded designs.
- Communications and Networking Leverage the high I/O count for packet handling, interface conversion, and board‑level connectivity in communication devices.
- Test & Measurement Deploy programmable logic and memory resources for custom data acquisition, timing, and control functions in test equipment.
Unique Advantages
- Substantial Logic Capacity: 114,480 logic elements allow complex algorithms and multiple concurrent functions to be implemented on a single FPGA.
- Integrated On‑Chip Memory: Approximately 3.98 Mbits of embedded RAM reduce reliance on external memory, simplifying BOM and board routing.
- High I/O Density: 528 I/O pins provide flexibility for multi‑bus systems, sensor arrays, and extensive peripheral interfacing without additional devices.
- Industrial Robustness: Rated for −40 °C to 100 °C operation and supplied in a surface‑mount 780‑FBGA package suitable for industrial PCB assembly.
- Controlled Power Envelope: A defined core voltage range (1.15 V–1.25 V) helps designers plan power rails and thermal management with precision.
Why Choose EP4CE115F29I7N?
The EP4CE115F29I7N balances large programmable logic resources, significant embedded memory, and a high I/O count in a single 780‑FBGA package, making it a strong choice for industrial and embedded designs that require on‑board programmability and dense interfacing. Its industrial temperature rating and RoHS compliance further support deployment in production systems.
This device suits engineers and product teams building mid‑to‑large complexity programmable solutions where consolidating logic, memory, and I/O into one FPGA reduces board complexity and simplifies system architecture. The Cyclone IV platform documentation provides detailed electrical, timing, and operating guidance to support design validation and qualification.
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