EP4CE115F29C9LN

IC FPGA 528 I/O 780FBGA
Part Description

Cyclone® IV E Field Programmable Gate Array (FPGA) IC 528 3981312 114480 780-BGA

Quantity 7 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time16 Weeks
Datasheet

Specifications & Environmental

Device Package780-FBGA (29x29)GradeCommercialOperating Temperature0°C – 85°C
Package / Case780-BGANumber of I/O528Voltage970 mV - 1.03 V
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs7155Number of Logic Elements/Cells114480
Number of GatesN/AECCN3A001A7AHTS Code8542.39.0001
QualificationN/ATotal RAM Bits3981312

Overview of EP4CE115F29C9LN – Cyclone IV E FPGA, 114,480 logic elements, 780‑BGA

The EP4CE115F29C9LN is a Cyclone® IV E Field Programmable Gate Array (FPGA) from Intel, provided in a 780‑FBGA (29×29) surface‑mount package. It provides a large logic fabric and on‑chip memory for programmable logic integration.

This device is suited to designs that require substantial programmable logic, significant embedded RAM, and high I/O counts while operating within commercial temperature and low‑voltage core supply ranges.

Key Features

  • Logic Capacity — 114,480 logic elements for implementing complex combinational and sequential logic.
  • Embedded Memory — Approximately 3.98 Mbits of on‑chip RAM to support buffering, lookup tables, and state storage.
  • I/O Resources — 528 general purpose I/O pins to interface with peripherals, sensors, and external devices.
  • Package & Mounting — 780‑FBGA (29×29) package in a surface‑mount format for compact board integration.
  • Core Voltage — Nominal core supply range from 0.97 V to 1.03 V to match power sequencing and regulator requirements.
  • Operating Temperature — Commercial grade operation from 0 °C to 85 °C.
  • Environmental Compliance — RoHS compliant.

Typical Applications

  • Custom Logic and Acceleration — Implement custom hardware accelerators and protocol offloads using the device’s large logic capacity and embedded RAM.
  • Digital Signal Processing — Use available logic and memory resources for streaming data paths, buffering, and real‑time processing tasks.
  • Prototyping and Development — Build and iterate complex FPGA designs that require a high number of I/Os and substantial on‑chip memory.

Unique Advantages

  • High Logic Density: 114,480 logic elements enable implementation of sizeable custom logic blocks without immediate upscaling.
  • Substantial On‑Chip Memory: Approximately 3.98 Mbits of embedded RAM reduces reliance on external memory for many buffering and state‑storage needs.
  • Extensive I/O Count: 528 I/Os simplify system integration by accommodating multiple interfaces and peripherals directly.
  • Compact BGA Package: 780‑FBGA (29×29) provides a dense package option for space‑constrained PCB layouts.
  • Low‑Voltage Core: Narrow core supply window (0.97 V–1.03 V) supports controlled power budgeting and regulator selection.
  • RoHS Compliant: Conforms to lead‑free manufacturing and environmental requirements.

Why Choose EP4CE115F29C9LN?

The EP4CE115F29C9LN positions itself as a high‑capacity Cyclone IV E FPGA that balances logic density, embedded memory, and extensive I/O in a compact 780‑FBGA package. Its commercial temperature range and RoHS compliance make it appropriate for mainstream embedded and development applications where sizeable programmable resources are required.

This device is ideal for engineering teams designing custom logic, data‑path acceleration, or complex prototyping platforms that need a significant number of logic elements and on‑chip RAM, while maintaining a compact board footprint and low core voltage requirements.

Request a quote or submit an inquiry to get pricing and availability for EP4CE115F29C9LN. Our team can assist with lead times, packaging options, and order placement.

Request a Quote

















    No file selected



    Our team will respond within 24 hours.


    I agree to receive newsletters and promotional emails. I can unsubscribe at any time.

    Certifications and Membership
    NQA AS9100 CMYK ANAB
    NQA AS9100 ANAB Badge
    ESD2020 Badge
    ESD2020 Association Badge
    GIDEP Badge
    GIDEP Badge
    Suntsu ERAI MemberVerification
    Suntsu ERAI Member Verification
    Available Shipping Methods
    FedEx
    UPS
    DHL
    Accepted Payment Methods
    American Express
    American Express
    Discover
    Discover
    MasterCard
    MasterCard
    Visa
    Visa
    UnionPay
    UnionPay

    Date Founded: 1968


    Headquarters: Santa Clara, California, USA


    Employees: 130,000+


    Revenue: $54.23 Billion


    Certifications and Memberships: ISO9001:2015, ISO14001:2015, ISO17025:2017, ISO27001:2022, ISO45001:2018, ISO50001:2018


    Featured Products
    Latest News
    keyboard_arrow_up