EP4CE115F29C9LN
| Part Description |
Cyclone® IV E Field Programmable Gate Array (FPGA) IC 528 3981312 114480 780-BGA |
|---|---|
| Quantity | 7 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 16 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 780-FBGA (29x29) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 780-BGA | Number of I/O | 528 | Voltage | 970 mV - 1.03 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 7155 | Number of Logic Elements/Cells | 114480 | ||
| Number of Gates | N/A | ECCN | 3A001A7A | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 3981312 |
Overview of EP4CE115F29C9LN – Cyclone IV E FPGA, 114,480 logic elements, 780‑BGA
The EP4CE115F29C9LN is a Cyclone® IV E Field Programmable Gate Array (FPGA) from Intel, provided in a 780‑FBGA (29×29) surface‑mount package. It provides a large logic fabric and on‑chip memory for programmable logic integration.
This device is suited to designs that require substantial programmable logic, significant embedded RAM, and high I/O counts while operating within commercial temperature and low‑voltage core supply ranges.
Key Features
- Logic Capacity — 114,480 logic elements for implementing complex combinational and sequential logic.
- Embedded Memory — Approximately 3.98 Mbits of on‑chip RAM to support buffering, lookup tables, and state storage.
- I/O Resources — 528 general purpose I/O pins to interface with peripherals, sensors, and external devices.
- Package & Mounting — 780‑FBGA (29×29) package in a surface‑mount format for compact board integration.
- Core Voltage — Nominal core supply range from 0.97 V to 1.03 V to match power sequencing and regulator requirements.
- Operating Temperature — Commercial grade operation from 0 °C to 85 °C.
- Environmental Compliance — RoHS compliant.
Typical Applications
- Custom Logic and Acceleration — Implement custom hardware accelerators and protocol offloads using the device’s large logic capacity and embedded RAM.
- Digital Signal Processing — Use available logic and memory resources for streaming data paths, buffering, and real‑time processing tasks.
- Prototyping and Development — Build and iterate complex FPGA designs that require a high number of I/Os and substantial on‑chip memory.
Unique Advantages
- High Logic Density: 114,480 logic elements enable implementation of sizeable custom logic blocks without immediate upscaling.
- Substantial On‑Chip Memory: Approximately 3.98 Mbits of embedded RAM reduces reliance on external memory for many buffering and state‑storage needs.
- Extensive I/O Count: 528 I/Os simplify system integration by accommodating multiple interfaces and peripherals directly.
- Compact BGA Package: 780‑FBGA (29×29) provides a dense package option for space‑constrained PCB layouts.
- Low‑Voltage Core: Narrow core supply window (0.97 V–1.03 V) supports controlled power budgeting and regulator selection.
- RoHS Compliant: Conforms to lead‑free manufacturing and environmental requirements.
Why Choose EP4CE115F29C9LN?
The EP4CE115F29C9LN positions itself as a high‑capacity Cyclone IV E FPGA that balances logic density, embedded memory, and extensive I/O in a compact 780‑FBGA package. Its commercial temperature range and RoHS compliance make it appropriate for mainstream embedded and development applications where sizeable programmable resources are required.
This device is ideal for engineering teams designing custom logic, data‑path acceleration, or complex prototyping platforms that need a significant number of logic elements and on‑chip RAM, while maintaining a compact board footprint and low core voltage requirements.
Request a quote or submit an inquiry to get pricing and availability for EP4CE115F29C9LN. Our team can assist with lead times, packaging options, and order placement.

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