EP4CE115F29C8LN

The EP4CE115F29C8LN is a Cyclone IV E family field programmable gate array (FPGA) from Intel, provided in a 780-FBGA (29×29) package for surface-mount assembly. It delivers high logic density and substantial embedded RAM in a commercial-grade device.

With 114,480 logic elements, approximately 3.98 Mbits of on-chip RAM and 528 I/Os, this device addresses designs that require large programmable logic capacity, dense I/O integration, and commercial temperature range operation.

Key Features

• Logic Capacity — 114,480 logic elements to implement sizeable custom digital functions and complex state machines.
• Embedded Memory — Approximately 3.98 Mbits of on-chip RAM for buffering, FIFOs, and small data tables without external memory.
• I/O Density — 528 I/Os supporting extensive external interfacing and high pin-count connectivity.
• Core Performance & Power — Core voltage supply range of 0.970 V to 1.03 V to match system power rails and design constraints.
• Package & Mounting — 780-BGA (780-FBGA, 29×29) surface-mount package for compact, high-pin-count board implementations.
• Operating Range — Commercial grade with an operating temperature range of 0 °C to 85 °C for standard commercial environments.
• Standards & Compliance — RoHS-compliant to support regulatory requirements for lead-free assembly.

Typical Applications

• High-density I/O systems — Use the device’s 528 I/Os to aggregate, translate, or route large numbers of signals in multi-interface designs.
• Memory-centric logic — Leverage approximately 3.98 Mbits of embedded RAM for buffering, data path staging, and packet handling without immediate external memory.
• Complex digital processing — Implement large custom logic functions and state machines using 114,480 logic elements for commercial embedded systems.

Unique Advantages

• High logic density: 114,480 logic elements enable consolidation of multiple functions into a single programmable device, reducing bill-of-materials and board complexity.
• Significant on-chip RAM: Approximately 3.98 Mbits of embedded memory minimizes dependence on external RAM for many buffering and data-handling tasks.
• Extensive I/O connectivity: 528 I/Os allow direct interfacing to numerous peripherals and buses, simplifying board-level routing and integration.
• Compact, high-pin-count package: The 780-FBGA (29×29) package provides a small footprint for dense designs while supporting a large number of signals.
• Commercial-grade suitability: Rated for 0 °C to 85 °C operation to meet typical commercial application requirements.
• Regulatory readiness: RoHS compliance supports lead-free assembly processes and environmental requirements.

Why Choose EP4CE115F29C8LN?

The EP4CE115F29C8LN combines substantial logic resources, embedded memory, and a high I/O count in a compact 780-FBGA surface-mount package, making it well suited for commercial designs that require high integration and flexible programmable logic. Its defined core voltage range and commercial operating temperature make it appropriate for standard commercial embedded systems and multi-interface applications.

For engineering teams targeting consolidation of digital functions, on-chip buffering, and dense board-level connectivity, this Cyclone IV E FPGA offers a balance of capacity and form factor with vendor-backed documentation for system design and validation.

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