EP4CE115F29C7
| Part Description |
Cyclone® IV E Field Programmable Gate Array (FPGA) IC 528 3981312 114480 780-BGA |
|---|---|
| Quantity | 1,880 Available (as of October 7, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 16 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 780-FBGA (29x29) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 780-BGA | Number of I/O | 528 | Voltage | 1.15 V - 1.25 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 7155 | Number of Logic Elements/Cells | 114480 | ||
| Number of Gates | N/A | ECCN | 3A001A7A | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 3981312 |
Overview of EP4CE115F29C7 – Cyclone® IV E Field Programmable Gate Array (FPGA), 114,480 logic elements, 528 I/O, 780-FBGA
The EP4CE115F29C7 is a Cyclone® IV E Field Programmable Gate Array (FPGA) IC designed for commercial applications requiring substantial logic capacity, abundant I/O, and on-chip memory. Built on the Cyclone IV device family, this surface-mount 780-FBGA (29×29) package combines 114,480 logic elements with approximately 3.98 Mbits of embedded RAM to support mid-range FPGA designs.
With a 528-pin I/O count and support for a core voltage range of 1.15 V to 1.25 V, the EP4CE115F29C7 addresses designs where integration density, configurable logic, and I/O flexibility are primary requirements within a commercial temperature window.
Key Features
- Core Architecture
Cyclone IV E family FPGA—programmable logic fabric suitable for a wide range of commercial applications, documented in the Cyclone IV Device Handbook. - Logic Capacity
114,480 logic elements provide substantial resources for complex state machines, glue logic, and custom hardware acceleration. - Embedded Memory
Approximately 3.98 Mbits of on-chip RAM to support buffers, FIFOs, and local data storage without external memory. - I/O Density
528 user I/O pins to accommodate multiple interfaces, parallel buses, and high-pin-count connectivity requirements. - Package & Mounting
780-ball FBGA (29×29) package, surface-mount mounting type, enabling compact board-level integration. - Power & Operating Range
Core supply voltage 1.15 V to 1.25 V; specified commercial operating temperature range of 0 °C to 85 °C. - Regulatory Compliance
RoHS compliant for lead-free assembly and end-product regulatory alignment. - Comprehensive Documentation
Device handbook and datasheet content provide operating conditions, DC characteristics, switching characteristics, and other design-oriented specifications.
Typical Applications
- Commercial Embedded Systems
Use the EP4CE115F29C7 to implement custom control, signal processing, and interface aggregation within commercial temperature requirements. - Communications and Networking Equipment
High I/O count and sizable logic/memory resources make the device suitable for protocol bridging, packet handling, and peripheral interfacing in commercial networking products. - Consumer and Industrial-Grade Instrumentation (Commercial Spec)
Deploy as the programmable backbone for measurement, acquisition, and control subsystems that operate within the specified commercial temperature range. - Prototyping and Product Development
Leverage the Cyclone IV E resource set for proof-of-concept designs and pre-production boards requiring significant logic density and on-chip RAM.
Unique Advantages
- High Logic Density: 114,480 logic elements enable implementation of complex digital designs without excessive external ASIC or ASSP dependence.
- Generous On-Chip Memory: Approximately 3.98 Mbits of embedded RAM reduce the need for external memory in many buffering and data-path applications.
- Extensive I/O Resources: 528 I/Os provide flexibility to support multiple interfaces and parallel connectivity on a single device.
- Compact, Surface-Mount Packaging: 780-FBGA (29×29) delivers a compact footprint for dense board layouts and high-pin-count designs.
- Commercial Temperature Rating: Specified operation from 0 °C to 85 °C aligns the device to mainstream commercial product deployments.
- RoHS Compliance: Meets lead-free assembly requirements for modern manufacturing processes.
Why Choose EP4CE115F29C7?
The EP4CE115F29C7 positions itself as a high-capacity, mid-range Cyclone IV E FPGA tailored for commercial applications that demand significant logic resources, plentiful I/O, and meaningful on-chip memory. Its 780-FBGA surface-mount package and documented operating and electrical characteristics make it suitable for developers and procurement teams targeting compact, integrated FPGA solutions.
This device is backed by Cyclone IV family documentation and datasheet material that detail electrical, thermal, and timing characteristics to support engineering evaluation and system integration. Choose EP4CE115F29C7 when you need a commercially graded FPGA with substantial logic density and I/O capability for scalable, board-level designs.
Request a quote or submit a purchase inquiry to evaluate EP4CE115F29C7 for your next commercial FPGA design.

Date Founded: 1968
Headquarters: Santa Clara, California, USA
Employees: 130,000+
Revenue: $54.23 Billion
Certifications and Memberships: ISO9001:2015, ISO14001:2015, ISO17025:2017, ISO27001:2022, ISO45001:2018, ISO50001:2018