EP4CE115F29C8L
| Part Description |
Cyclone® IV E Field Programmable Gate Array (FPGA) IC 528 3981312 114480 780-BGA |
|---|---|
| Quantity | 290 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 16 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 780-FBGA (29x29) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 780-BGA | Number of I/O | 528 | Voltage | 970 mV - 1.03 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 7155 | Number of Logic Elements/Cells | 114480 | ||
| Number of Gates | N/A | ECCN | 3A001A7A | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 3981312 |
Overview of EP4CE115F29C8L – Cyclone IV E Field Programmable Gate Array (FPGA), 780-BGA
The EP4CE115F29C8L is a Cyclone® IV E field programmable gate array (FPGA) in a 780-ball BGA package. It provides a high-density programmable logic fabric with embedded memory and a large number of I/O pins for commercial embedded and digital applications.
Designed for system integration where logic capacity, on-chip RAM and extensive I/O are required, the device combines 114,480 logic elements with approximately 3.98 Mbits of embedded RAM and 528 I/O pins in a compact surface-mount 780-FBGA (29×29) package.
Key Features
- Logic Capacity Provides 114,480 logic elements suitable for complex digital logic and system integration tasks.
- Embedded Memory Approximately 3.98 Mbits of on-chip RAM to support buffering, state storage and local data processing without external memory.
- I/O Density 528 dedicated I/O pins enable extensive peripheral connectivity and board-level interfacing.
- Power and Voltage Core supply voltage range from 970 mV to 1.03 V for the device core domain.
- Package & Mounting 780-BGA package (supplier device package: 780-FBGA, 29×29) in a surface-mount form factor for high-density PCB implementations.
- Operating Range & Grade Commercial grade device with specified operating temperature range of 0°C to 85°C.
- Standards & Compliance RoHS-compliant construction for regulatory and manufacturing compatibility.
- Documentation Coverage Datasheet and device handbook content include operating conditions, absolute maximum ratings, DC characteristics, power consumption, switching characteristics and transceiver/core performance specifications.
Typical Applications
- High-density digital systems Implement complex combinational and sequential logic using 114,480 logic elements and integrated RAM to minimize external components.
- Board-level I/O aggregation Use 528 I/O pins to concentrate multiple peripherals and interfaces on a single programmable device.
- Embedded system prototyping Leverage programmable logic and on-chip memory for rapid development and iterative hardware design.
- Data buffering and local processing Take advantage of approximately 3.98 Mbits of embedded RAM for packet buffering, FIFOs or small on-chip datasets.
Unique Advantages
- High logic capacity: 114,480 logic elements enable implementation of large-scale digital functions within a single FPGA.
- Substantial on-chip memory: Approximately 3.98 Mbits of embedded RAM reduces reliance on external memory for many buffering and storage needs.
- Extensive I/O resources: 528 I/O pins provide design flexibility for complex interconnect and multiple peripheral interfaces.
- Compact, manufacturable package: 780-FBGA (29×29) surface-mount package supports high-density PCB layouts while maintaining mechanical and thermal compatibility for commercial designs.
- Documented device specifications: Device handbook and datasheet content cover operating conditions, electrical characteristics and performance parameters to support design and verification.
- Regulatory compliance: RoHS-compliant construction supports environmentally responsible manufacturing.
Why Choose EP4CE115F29C8L?
The EP4CE115F29C8L positions itself as a high-capacity Cyclone IV E FPGA option for commercial embedded designs that require a combination of large logic resources, significant on-chip RAM and abundant I/O in a compact 780-BGA package. Its documented electrical and performance specifications help engineers evaluate suitability across power, timing and interfacing requirements.
This device is well-suited to engineering teams and procurement looking for a programmable logic IC that balances integration density and board-level I/O capability while operating within a commercial temperature range. The availability of extensive device handbook and datasheet information supports design verification and long-term maintainability.
Request a quote or submit an inquiry to obtain pricing, availability and lead-time information for EP4CE115F29C8L.

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