EP4CE115F29C8L

IC FPGA 528 I/O 780FBGA
Part Description

Cyclone® IV E Field Programmable Gate Array (FPGA) IC 528 3981312 114480 780-BGA

Quantity 290 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time16 Weeks
Datasheet

Specifications & Environmental

Device Package780-FBGA (29x29)GradeCommercialOperating Temperature0°C – 85°C
Package / Case780-BGANumber of I/O528Voltage970 mV - 1.03 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs7155Number of Logic Elements/Cells114480
Number of GatesN/AECCN3A001A7AHTS Code8542.39.0001
QualificationN/ATotal RAM Bits3981312

Overview of EP4CE115F29C8L – Cyclone IV E Field Programmable Gate Array (FPGA), 780-BGA

The EP4CE115F29C8L is a Cyclone® IV E field programmable gate array (FPGA) in a 780-ball BGA package. It provides a high-density programmable logic fabric with embedded memory and a large number of I/O pins for commercial embedded and digital applications.

Designed for system integration where logic capacity, on-chip RAM and extensive I/O are required, the device combines 114,480 logic elements with approximately 3.98 Mbits of embedded RAM and 528 I/O pins in a compact surface-mount 780-FBGA (29×29) package.

Key Features

  • Logic Capacity  Provides 114,480 logic elements suitable for complex digital logic and system integration tasks.
  • Embedded Memory  Approximately 3.98 Mbits of on-chip RAM to support buffering, state storage and local data processing without external memory.
  • I/O Density  528 dedicated I/O pins enable extensive peripheral connectivity and board-level interfacing.
  • Power and Voltage  Core supply voltage range from 970 mV to 1.03 V for the device core domain.
  • Package & Mounting  780-BGA package (supplier device package: 780-FBGA, 29×29) in a surface-mount form factor for high-density PCB implementations.
  • Operating Range & Grade  Commercial grade device with specified operating temperature range of 0°C to 85°C.
  • Standards & Compliance  RoHS-compliant construction for regulatory and manufacturing compatibility.
  • Documentation Coverage  Datasheet and device handbook content include operating conditions, absolute maximum ratings, DC characteristics, power consumption, switching characteristics and transceiver/core performance specifications.

Typical Applications

  • High-density digital systems  Implement complex combinational and sequential logic using 114,480 logic elements and integrated RAM to minimize external components.
  • Board-level I/O aggregation  Use 528 I/O pins to concentrate multiple peripherals and interfaces on a single programmable device.
  • Embedded system prototyping  Leverage programmable logic and on-chip memory for rapid development and iterative hardware design.
  • Data buffering and local processing  Take advantage of approximately 3.98 Mbits of embedded RAM for packet buffering, FIFOs or small on-chip datasets.

Unique Advantages

  • High logic capacity: 114,480 logic elements enable implementation of large-scale digital functions within a single FPGA.
  • Substantial on-chip memory: Approximately 3.98 Mbits of embedded RAM reduces reliance on external memory for many buffering and storage needs.
  • Extensive I/O resources: 528 I/O pins provide design flexibility for complex interconnect and multiple peripheral interfaces.
  • Compact, manufacturable package: 780-FBGA (29×29) surface-mount package supports high-density PCB layouts while maintaining mechanical and thermal compatibility for commercial designs.
  • Documented device specifications: Device handbook and datasheet content cover operating conditions, electrical characteristics and performance parameters to support design and verification.
  • Regulatory compliance: RoHS-compliant construction supports environmentally responsible manufacturing.

Why Choose EP4CE115F29C8L?

The EP4CE115F29C8L positions itself as a high-capacity Cyclone IV E FPGA option for commercial embedded designs that require a combination of large logic resources, significant on-chip RAM and abundant I/O in a compact 780-BGA package. Its documented electrical and performance specifications help engineers evaluate suitability across power, timing and interfacing requirements.

This device is well-suited to engineering teams and procurement looking for a programmable logic IC that balances integration density and board-level I/O capability while operating within a commercial temperature range. The availability of extensive device handbook and datasheet information supports design verification and long-term maintainability.

Request a quote or submit an inquiry to obtain pricing, availability and lead-time information for EP4CE115F29C8L.

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