EP4CE115F29C9L

The EP4CE115F29C9L is a Cyclone® IV E field-programmable gate array (FPGA) from Intel, offering large programmable-logic capacity in a compact BGA package. It integrates high logic density, embedded RAM, and a high-count I/O complement for complex system integration.

Designed for commercial-temperature applications, this device targets designs that require significant on-chip logic and memory while maintaining a low-voltage core and a high-density surface-mount package.

Key Features

• Logic Capacity  114,480 logic elements to support complex digital designs and large-scale soft logic implementations.
• Embedded Memory  Approximately 3.98 Mbits of on-chip RAM (3,981,312 total RAM bits) for buffering, FIFOs, and local data storage.
• I/O Density  528 general-purpose I/Os to support wide parallel interfaces, multiple peripherals, and high-pin-count system interconnects.
• Package & Mounting  780-ball FBGA (29×29) surface-mount package (780-BGA) for space-efficient board integration and high routing density.
• Power & Core Voltage  Core voltage supply specified from 0.970 V to 1.03 V to match low-voltage system power rails and enable optimized power profiles.
• Operating Range & Grade  Commercial-grade device rated for 0 °C to 85 °C operation.
• Compliance  RoHS compliant for compatibility with common environmental and manufacturing requirements.

Typical Applications

• Custom Digital Processing  Programmable logic capacity and on-chip RAM make the device suitable for implementing customized data-paths, signal-processing blocks, and control logic.
• Interface Bridging  High I/O count supports protocol conversion, bus bridging, and glue-logic between heterogeneous subsystems.
• Prototyping & Development  Large logic element count and embedded memory provide headroom for system prototyping and iterative hardware development.

Unique Advantages

• High Logic Density: 114,480 logic elements enable complex finite-state machines, wide datapaths, and substantial soft-core implementations without external logic.
• On-Chip RAM for Local Storage: Approximately 3.98 Mbits of embedded memory reduces dependence on external memory for buffering and temporary storage.
• Extensive I/O Resources: 528 I/Os allow flexible interfacing to sensors, peripherals, and parallel buses, simplifying system-level integration.
• Compact, High-Pin-Count Package: 780-FBGA (29×29) delivers high routing density while keeping PCB footprint manageable for space-constrained designs.
• Low-Voltage Core Support: Specified core voltage range (0.970–1.03 V) enables integration into low-voltage power domains and careful power budgeting.
• RoHS Compliant: Meets common environmental requirements for modern electronics manufacturing.

Why Choose EP4CE115F29C9L?

The EP4CE115F29C9L balances substantial programmable logic resources and embedded memory with a high I/O count in a compact 780-FBGA package, delivering a practical platform for complex digital systems at commercial temperature ratings. It is well suited to engineers and teams developing custom logic, interface solutions, and prototypes that require on-chip capacity without expanding board-level complexity.

With Intel's Cyclone IV E architecture and documented device specifications, this FPGA offers a predictable, documented platform for medium-to-large scale programmable logic designs where integration, I/O density, and local memory are priorities.

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