EP4CE115F29I7

The EP4CE115F29I7 is a Cyclone® IV E field programmable gate array (FPGA) IC packaged in a 780‑ball BGA. It provides a high-density programmable logic fabric with substantial on-chip RAM and broad I/O capacity for integration into complex electronic systems.

Designed for industrial applications, the device combines 114,480 logic elements, approximately 3.98 Mbits of embedded memory, and 528 I/O pins in a surface-mount 780‑FBGA (29×29) package, supporting designs that require significant logic and connectivity within a compact footprint.

Key Features

• Core Capacity — 114,480 logic elements for implementing large-scale programmable logic and custom digital functions.
• Configurable Logic Blocks — 7,155 CLB-style logic blocks (reported as Number Of Labs Clbs) to structure complex logic designs.
• Embedded Memory — Approximately 3.98 Mbits of on-chip RAM to support buffering, FIFOs, and memory-mapped logic.
• I/O Resources — 528 I/O pins to interface with multiple peripherals, sensors, and high-density connectors.
• Power Supply — Core voltage supply range of 1.15 V to 1.25 V to match platform power domains.
• Package and Mounting — 780‑FBGA (29×29) surface-mount package for high-density board integration.
• Industrial Temperature Range — Rated for operation from −40 °C to 100 °C for deployment in industrial environments.
• Standards Compliance — RoHS compliant.

Typical Applications

• Industrial Control Systems — Use the device's logic capacity and industrial temperature rating to implement custom control and sequencing functions in industrial equipment.
• High‑Density I/O Integration — Leverage 528 I/Os for board-level glue logic, protocol bridging, and multi-interface aggregation.
• Memory‑Intensive Logic — Deploy internal RAM (approximately 3.98 Mbits) for buffering, packet processing, and intermediate data storage.
• Compact System Designs — Integrate significant programmable logic and I/O in a 780‑FBGA surface-mount package for space-constrained PCBs.

Unique Advantages

• High Logic Density: 114,480 logic elements enable implementation of sizable custom logic and state machines without external PLD resources.
• Substantial On‑Chip Memory: Approximately 3.98 Mbits of embedded memory reduces dependence on external RAM for many buffering and storage needs.
• Extensive I/O Count: 528 I/Os provide flexibility to connect multiple subsystems, sensors, and interfaces directly to the FPGA.
• Industrial‑Grade Operation: Specified operation from −40 °C to 100 °C supports deployment in a wide range of temperature-challenging environments.
• Compact BGA Package: 780‑FBGA (29×29) surface-mount package offers high pin count in a compact footprint for dense board designs.
• Regulatory Compliance: RoHS compliance supports environmentally conscious manufacturing and supply-chain requirements.

Why Choose EP4CE115F29I7?

The EP4CE115F29I7 Cyclone® IV E FPGA delivers a balance of high logic capacity, significant embedded memory, and extensive I/O in a compact 780‑BGA surface-mount package. Its industrial temperature rating and RoHS compliance make it suitable for demanding electronic systems that require reliable programmable logic and dense connectivity.

This device is well suited for teams and projects that need to consolidate discrete logic, implement complex state machines, or add large-scale programmable functions while preserving board space and supporting industrial operating conditions. Documentation and device specifications are available in the Cyclone IV Device Handbook for design and qualification reference.

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