EP4CE115F29C8N

The EP4CE115F29C8N is an Intel Cyclone IV E series FPGA offering high logic capacity and on-chip memory in a compact ball-grid array package. It delivers 114,480 logic elements and approximately 3.98 Mbits of embedded RAM, with up to 528 available I/O pins for dense system integration.

Designed for commercial-grade applications, the device is supplied in a 780-FBGA (29×29) surface-mount package, operates from a 1.15 V to 1.25 V core supply, and is specified for 0 °C to 85 °C. Documentation for the Cyclone IV family and device-level operating details are available in the Cyclone IV Device Handbook and device datasheet.

Key Features

• Core — Cyclone IV E architecture with 114,480 logic elements and 7,155 LABs for large-scale logic implementation.
• Embedded Memory — Approximately 3.98 Mbits of on-chip RAM to support data buffering, state machines, and local storage without immediate need for external memory.
• I/O Density — Up to 528 I/O pins enable broad peripheral and interface connectivity on a single device.
• Package & Mounting — 780-FBGA (29×29) package optimized for surface-mount PCB assembly and compact system footprints.
• Power — Core supply voltage range of 1.15 V to 1.25 V for predictable power budgeting and system design.
• Operating Range & Grade — Commercial temperature grade rated from 0 °C to 85 °C for general-purpose, commercial deployments.
• Regulatory — RoHS compliant.

Typical Applications

• High-density logic designs — Implement complex digital functions that require extensive on-chip logic resources and LAB capacity.
• I/O-intensive systems — Support boards and subsystems that need a large number of general-purpose I/O signals for sensors, peripherals, or parallel interfaces.
• Embedded memory-dependent functions — Leverage approximately 3.98 Mbits of embedded RAM for buffering, lookup tables, and local data storage tasks.

Unique Advantages

• High logic capacity: 114,480 logic elements provide the resource headroom required for complex, multi-function designs.
• Significant on-chip memory: Approximately 3.98 Mbits of embedded RAM reduces dependency on external memory devices.
• Large I/O complement: 528 I/Os simplify integration with multiple peripherals and external interfaces on a single device.
• Compact BGA packaging: The 780-FBGA (29×29) footprint supports dense board layouts while remaining surface-mount compatible.
• Predictable supply and thermal envelope: Documented core voltage range (1.15 V–1.25 V) and commercial operating temperature (0 °C–85 °C) aid reliable system planning.
• Environmentally compliant: RoHS compliance supports environmentally conscious manufacturing processes.

Why Choose EP4CE115F29C8N?

EP4CE115F29C8N positions itself as a high-capacity, commercially rated Cyclone IV E FPGA suited for designs that demand large amounts of logic, substantial embedded RAM, and a high I/O count in a compact surface-mount package. Its documented operating conditions and device handbook support predictable integration and system-level planning.

This device is appropriate for engineering teams and procurement looking for a commercially graded FPGA with clear electrical and thermal specifications, significant on-chip resources, and RoHS compliance. It is supported by the Cyclone IV device documentation for implementation and design guidance.

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