EP4CE115F29C8
| Part Description |
Cyclone® IV E Field Programmable Gate Array (FPGA) IC 528 3981312 114480 780-BGA |
|---|---|
| Quantity | 75 Available (as of October 7, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 16 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 780-FBGA (29x29) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 780-BGA | Number of I/O | 528 | Voltage | 1.15 V - 1.25 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 7155 | Number of Logic Elements/Cells | 114480 | ||
| Number of Gates | N/A | ECCN | 3A001A7A | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 3981312 |
Overview of EP4CE115F29C8 – Cyclone IV E Field Programmable Gate Array (780-BGA)
The EP4CE115F29C8 is a Cyclone® IV E Field Programmable Gate Array (FPGA) from Intel, provided in a 780-ball FBGA supplier package (29x29). It delivers a high-density programmable logic fabric with abundant I/O and embedded memory for complex, customizable digital designs.
Built for commercial-temperature systems, this device offers a combination of large logic resources, significant on-chip RAM, and a compact BGA package suitable for a wide range of programmable-logic applications that require configurable logic, interconnect, and I/O integration.
Key Features
- Logic Capacity — 114,480 logic elements provide substantial programmable logic resources for complex designs and custom hardware acceleration.
- Logic Blocks — 7,155 LABs/CLBs enable structured implementation of combinational and sequential logic networks.
- Embedded Memory — Approximately 3.98 Mbits of on-chip RAM for FIFOs, buffering, and memory-mapped data structures.
- I/O Density — 528 general-purpose I/O pins to support extensive peripheral and bus connectivity.
- Package — 780-BGA (supplier package: 780-FBGA (29x29)) for high pin-count routing in a compact footprint.
- Power Supply — Core voltage operation between 1.15 V and 1.25 V to match system core power rails.
- Mounting & Grade — Surface-mount device with commercial operating temperature range from 0 °C to 85 °C.
- Regulatory — RoHS compliant.
Typical Applications
- Custom Digital Logic — Implement application-specific processing, hardware accelerators, and glue logic using the FPGA’s programmable fabric and abundant logic elements.
- I/O Expansion and Protocol Bridging — Use the 528 I/Os to interface multiple peripherals, buses, and external devices with flexible pin assignments.
- On-Chip Memory Tasks — Leverage approximately 3.98 Mbits of embedded RAM for buffering, FIFOs, and small data stores within system logic.
Unique Advantages
- High Logic Density: 114,480 logic elements enable implementation of sizeable and complex logic functions without external gate arrays.
- Substantial Embedded RAM: Approximately 3.98 Mbits of on-chip memory reduces reliance on external RAM for mid-size buffering and state storage.
- Large I/O Count: 528 I/Os simplify routing for systems that require many peripheral connections or multiple interface standards.
- Compact High-Pin Package: 780-BGA (780-FBGA, 29x29) consolidates high connectivity in a space-efficient footprint for dense PCBs.
- Commercial Temperature Rating: Rated for 0 °C to 85 °C operation to meet typical commercial environment requirements.
- RoHS Compliance: Meets RoHS requirements to support environmental and regulatory goals.
Why Choose EP4CE115F29C8?
The EP4CE115F29C8 positions itself as a high-capacity, commercially graded Cyclone IV E FPGA that balances large programmable logic resources, significant embedded memory, and a high I/O count in a compact 780-BGA package. It is well suited for engineering teams and product designs that require flexible, reprogrammable hardware logic, extensive peripheral interfacing, and on-chip memory for buffering or intermediate storage.
With a defined core supply range and commercial temperature support, the device offers predictable integration into systems where density, configurability, and PCB space efficiency are primary considerations. Its RoHS compliance supports today’s regulatory expectations while the Cyclone IV E architecture provides established ecosystem support for development and deployment.
To request a quote or submit an inquiry for EP4CE115F29C8, please reach out to our sales team with your quantity and delivery requirements.

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