EP4CE115F23I8L

The EP4CE115F23I8L is an Intel Cyclone® IV E family FPGA delivered in a 484-ball fine-pitch BGA package. It integrates a large logic capacity and on-chip embedded memory to support complex programmable logic implementations.

With 114,480 logic elements, approximately 3.98 Mbits of embedded memory, and 280 user I/Os, this device targets designs that require high logic density, substantial on-chip RAM, and a broad I/O complement while operating across an industrial temperature range.

Key Features

• Logic Capacity — 114,480 logic elements provide a high-density programmable fabric for complex logic and custom architectures.
• On‑Chip Memory — Approximately 3.98 Mbits of embedded RAM to support data buffering, FIFOs, and local storage without external memory for many functions.
• I/O Resources — 280 user I/Os to accommodate a wide range of parallel interfacing and system connectivity requirements.
• Power Supply — Core voltage specified from 0.97 V to 1.03 V to match system power rails and enable predictable power integration.
• Package & Mounting — 484-FBGA (23x23) package, surface-mount mounting type, suitable for compact board layouts where a high pin count is required.
• Industrial Temperature Range — Rated for operation from -40 °C to 100 °C to meet industrial environment thermal requirements.
• Regulatory Compliance — RoHS compliant.

Unique Advantages

• High logic density: 114,480 logic elements enable integration of substantial functionality into a single device, reducing component count.
• Significant on‑chip memory: Approximately 3.98 Mbits of embedded RAM minimizes dependence on external memory for many data-path and buffering needs.
• Extensive I/O: 280 user I/Os provide flexibility for interfacing multiple peripherals, buses, and parallel signals directly at the FPGA.
• Industrial robustness: Specified operation from -40 °C to 100 °C supports deployment in temperature-challenging environments.
• Compact, high‑pin package: 484-FBGA (23x23) delivers high pin density while maintaining a small PCB footprint for space-constrained designs.
• Controlled core supply range: A defined 0.97–1.03 V core supply range facilitates integration with targeted power delivery designs.

Why Choose EP4CE115F23I8L?

The EP4CE115F23I8L combines a large programmable fabric, substantial embedded memory, and a broad I/O count in a compact 484-FBGA package rated for industrial temperatures. These characteristics make it well suited for teams and projects that need to consolidate complex logic and memory on a single FPGA while maintaining predictable power and thermal design boundaries.

Backed by Intel’s Cyclone IV device family documentation, this device offers a verifiable specification set for procurement and system design, with RoHS compliance for regulatory alignment and surface-mount packaging for modern PCB assembly processes.

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