EP4CE115F23C9L

The EP4CE115F23C9L is a Cyclone IV E field programmable gate array (FPGA) from Intel, offered in a 484-FBGA (23×23) surface-mount package for commercial applications. It delivers substantial on-chip logic and embedded memory capacity alongside a large I/O count, enabling integration of complex digital functions in commercial electronic systems.

Key technical attributes include 114,480 logic elements, approximately 3.98 Mbits of on‑chip RAM, 280 I/Os, a 0.97 V–1.03 V core supply range, and an operating temperature range of 0 °C to 85 °C. The device is RoHS compliant and is documented in the Cyclone IV device handbook.

Key Features

• Logic Capacity — 114,480 logic elements provide substantial resources for implementing large-scale combinational and sequential logic functions.
• Logic Array Blocks — 7,155 LABs (logic array blocks) as specified for this device provide the structural building blocks for mapped designs.
• Embedded Memory — Approximately 3.98 Mbits of total on‑chip RAM to support buffering, state storage, and data-path requirements.
• I/O Count — 280 user I/O pins accommodate wide parallel interfaces, multiple peripherals, and board-level connectivity.
• Package and Mounting — 484‑FBGA (23×23) package in a surface-mount form factor for high-density PCB layouts.
• Power — Core supply voltage range of 0.97 V to 1.03 V for compatibility with defined system power domains.
• Operating Range — Commercial temperature grade with an operating range of 0 °C to 85 °C.
• Compliance — RoHS‑compliant construction.

Unique Advantages

• High integration density: 114,480 logic elements and thousands of LABs allow consolidation of multiple functions into a single device, reducing board-level component count.
• Significant embedded memory: Approximately 3.98 Mbits of on‑chip RAM simplifies implementation of FIFOs, buffers, and local data storage without external memory.
• Generous I/O resources: 280 I/Os enable flexible interfacing to peripherals, buses, and external devices without immediate need for external I/O expanders.
• Compact surface-mount package: 484‑FBGA (23×23) supports dense PCB designs while delivering large resource counts in a single package.
• Commercial suitability: Designed and specified for commercial temperature operation (0 °C to 85 °C) and RoHS compliance for regulatory adherence.
• Documented platform: Supported by Cyclone IV device documentation, providing reference material for design and integration.

Why Choose EP4CE115F23C9L?

The EP4CE115F23C9L positions itself as a high‑capacity Cyclone IV E FPGA for commercial designs that require substantial logic, embedded memory, and I/O resources in a compact 484‑FBGA package. Its specified voltage range and temperature rating make it suitable for a wide range of commercial electronic products where on‑chip integration and board‑space efficiency are priorities.

Engineers and procurement teams will find this device appropriate for designs that benefit from a well-documented Cyclone IV platform and the integration advantages of large logic and memory resources on a single, RoHS‑compliant FPGA package.

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