EP4CE115F23C8N

The EP4CE115F23C8N is a Cyclone® IV field programmable gate array (FPGA) packaged in a 484-ball BGA intended for surface-mount applications. It delivers a large logic fabric and on-chip memory resources to implement custom digital logic, interface glue, and system integration functions.

As part of the Cyclone IV family, this commercial‑grade device combines 114,480 logic elements with approximately 3.98 Mbits of embedded memory and 280 general-purpose I/O to address medium‑to‑high complexity FPGA designs while operating from a 1.15 V to 1.25 V core supply.

Key Features

• Logic Capacity — 114,480 logic elements provide the programmable fabric required for complex digital designs and state machines.
• Embedded Memory — Approximately 3.98 Mbits of on‑chip RAM for buffering, FIFOs, and local data storage.
• I/O Count — 280 I/O pins to support multiple external interfaces and board-level connectivity.
• Fabric Structure — 7,155 logic blocks (as reported) for organized implementation of logic resources.
• Package & Mounting — 484‑BGA package (supplier device package: 484‑FBGA, 23×23) in a surface‑mount form factor for compact PCB integration.
• Power — Core voltage supply range of 1.15 V to 1.25 V to match system power rails for the device core.
• Operating Range — Commercial operating temperature range from 0 °C to 85 °C for standard electronics environments.
• Compliance — RoHS‑compliant device packaging and materials.
• Documentation — Device-level specifications and application guidance are available in the Cyclone IV Device Handbook (referenced in the device datasheet).

Typical Applications

• Embedded Processing and Control — Implement custom control logic and glue logic using the high logic element count and embedded RAM for local state and buffering.
• Interface Consolidation — Use the 280 I/O pins to aggregate and translate multiple peripheral interfaces on a single FPGA fabric.
• Prototyping and System Integration — Leverage the programmable fabric and on‑chip memory to prototype and validate digital subsystems prior to production.

Unique Advantages

• High Logic Density: 114,480 logic elements enable implementation of complex digital functions without immediate need for external logic ICs.
• Substantial On‑Chip RAM: Approximately 3.98 Mbits of embedded memory reduces dependence on external memory for many buffering and packetization tasks.
• Extensive I/O: 280 I/O pins support broad interfacing options, simplifying board-level connectivity and reducing additional interface components.
• Compact BGA Packaging: 484‑FBGA (23×23) package supports high pin count in a compact footprint for space‑constrained PCBs.
• Commercial Grade and RoHS Compliant: Suitable for standard commercial electronics products with environmentally compliant materials.
• Documented Device Family: Backed by the Cyclone IV Device Handbook for device‑level specifications and recommended operating conditions.

Why Choose EP4CE115F23C8N?

The EP4CE115F23C8N positions itself as a high‑capacity Cyclone IV FPGA option for designs requiring significant programmable logic, embedded memory, and a large I/O complement within a compact BGA package. Its operating voltage range and commercial temperature rating make it appropriate for standard embedded and system integration projects.

Engineers designing mid‑to‑high complexity digital systems can leverage the device’s logic density, embedded RAM, and documented Cyclone IV device specifications to scale designs, consolidate interfaces, and shorten development cycles while relying on RoHS‑compliant packaging.

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