EP4CE115F23C8L

The EP4CE115F23C8L is an Intel Cyclone® IV E field programmable gate array supplied in a 484‑BGA (484‑FBGA, 23×23) package for surface‑mount assembly. The device provides 114,480 logic elements and approximately 3.98 Mbits of embedded memory with 280 available I/O pins, targeting designs that require high logic density and substantial on‑chip RAM.

Operating from a nominal core supply range of 0.970 V to 1.03 V and specified for commercial‑grade operation from 0 °C to 85 °C, the device is RoHS compliant. Detailed device electrical and timing information is available in the Cyclone IV device handbook and related datasheet materials.

Key Features

• Logic Density – 114,480 logic elements to implement complex programmable logic functions and consolidated digital designs.
• Embedded Memory – Approximately 3.98 Mbits of on‑chip RAM for buffering, state storage, and intermediate data structures.
• I/O Capacity – 280 user I/O pins to support broad interfacing requirements and parallel signaling.
• Package and Mounting – 484‑BGA (supplier package: 484‑FBGA, 23×23) in a surface‑mount configuration suitable for compact board layouts.
• Power – Core voltage supply range of 0.970 V to 1.03 V for system power planning and voltage regulator selection.
• Operating Conditions & Grade – Commercial grade device specified for 0 °C to 85 °C ambient operation.
• Compliance – RoHS compliant for adherence to common environmental requirements.

Typical Applications

• High‑density programmable logic – Implement complex finite state machines, custom datapaths, and logic consolidation using the device's 114,480 logic elements.
• On‑chip buffering and storage – Use approximately 3.98 Mbits of embedded memory for frame buffers, FIFOs, and temporary data storage close to logic.
• I/O‑intensive control and interfacing – Leverage 280 I/O pins for parallel interfaces, multi‑channel sensor aggregation, or control buses.

Unique Advantages

• High logic capacity: 114,480 logic elements enable consolidation of multiple functions into a single FPGA, reducing board complexity.
• Substantial on‑chip memory: Approximately 3.98 Mbits of embedded RAM reduces dependence on external memory for many buffering and temporary storage tasks.
• Robust I/O count: 280 I/O pins support flexible system partitioning and multiple interface implementations without immediate need for IO expanders.
• Compact BGA package: 484‑BGA (484‑FBGA, 23×23) offers a dense footprint for space‑constrained designs while supporting surface‑mount assembly.
• Commercial temperature rating: Specified for 0 °C to 85 °C operation to match typical commercial and professional electronics environments.
• RoHS compliant: Meets common environmental requirements for modern electronic assemblies.

Why Choose EP4CE115F23C8L?

The EP4CE115F23C8L delivers a combination of high logic density, meaningful on‑chip memory, and extensive I/O in a compact 484‑BGA package, making it a strong fit for designers seeking to consolidate digital logic, implement sizeable buffering, and maintain flexible interfacing options. Its commercial temperature rating and RoHS compliance support deployment across a wide range of professional electronics applications.

Engineers and procurement teams can rely on the device's documented electrical and timing specifications in the Cyclone IV device handbook and related datasheet materials to plan power, thermal, and system integration with confidence.

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