EP4CE115F23C7N

IC FPGA 280 I/O 484FBGA
Part Description

Cyclone® IV E Field Programmable Gate Array (FPGA) IC 280 3981312 114480 484-BGA

Quantity 287 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time16 Weeks
Datasheet

Specifications & Environmental

Device Package484-FBGA (23x23)GradeCommercialOperating Temperature0°C – 85°C
Package / Case484-BGANumber of I/O280Voltage1.15 V - 1.25 V
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs7155Number of Logic Elements/Cells114480
Number of GatesN/AECCN3A001A7AHTS Code8542.39.0001
QualificationN/ATotal RAM Bits3981312

Overview of EP4CE115F23C7N – Cyclone® IV E Field Programmable Gate Array (FPGA), 484‑BGA

The EP4CE115F23C7N is a Cyclone IV E Field Programmable Gate Array (FPGA) IC providing high-density programmable logic and on-chip memory in a 484‑FBGA (23×23) surface‑mount package. Its data sheet and device handbook detail operating conditions and electrical characteristics for system-level integration.

This device offers 114,480 logic elements, approximately 3.98 Mbits of embedded memory (3,981,312 total RAM bits), and 280 user I/O pins, delivering the core resources required for complex programmable logic designs while operating from a 1.15 V to 1.25 V core supply.

Key Features

  • Core Logic  114,480 logic elements provide substantial programmable resources for implementing custom digital functions and state machines.
  • Embedded Memory  Approximately 3.98 Mbits of on-chip RAM (3,981,312 total RAM bits) for buffering, FIFOs, and local data storage.
  • I/O and Package  280 I/O pins in a 484‑FBGA (23×23) package, optimized for dense board-level routing and high-pin-count applications.
  • Power  Core voltage supply specified at 1.15 V to 1.25 V to match modern low-voltage power rails.
  • Mounting and Package Type  Surface-mount BGA package (484-BGA / 484-FBGA) suitable for automated PCB assembly.
  • Operating Range & Grade  Commercial-grade device with an operating temperature range of 0 °C to 85 °C and RoHS-compliant materials.

Unique Advantages

  • High logic density: 114,480 logic elements enable consolidation of multiple functions into a single FPGA, reducing board-level component count.
  • Significant on-chip RAM: Approximately 3.98 Mbits of embedded memory supports local buffering and data storage without immediate external memory dependencies.
  • Generous I/O resources: 280 I/Os in a 484‑FBGA package provide flexibility for interfacing to a wide range of peripherals and high-pin-count subsystems.
  • Low-voltage core support: Core supply specified from 1.15 V to 1.25 V aligns with contemporary low-voltage power domains.
  • Commercial temperature suitability: Rated for 0 °C to 85 °C operation for standard commercial deployments and environments.
  • RoHS compliant: Manufactured with RoHS-compliant materials for environmental and regulatory alignment.

Why Choose EP4CE115F23C7N?

The EP4CE115F23C7N positions itself as a high-capacity Cyclone IV E FPGA option for designs that require substantial logic resources, embedded memory, and flexible I/O in a compact BGA footprint. Its specification set—114,480 logic elements, ~3.98 Mbits of RAM, 280 I/Os, and a 484‑FBGA (23×23) surface-mount package—supports consolidation of complex digital functions while matching modern low-voltage system rails.

This commercial-grade device is appropriate for engineering teams and procurement seeking a well-documented Cyclone IV E FPGA with clear electrical and package specifications, RoHS compliance, and standard operating temperature coverage. Its resource balance supports scalable designs that benefit from on-chip memory and abundant I/O connectivity.

Request a quote or submit an inquiry to obtain pricing and availability for the EP4CE115F23C7N. Provide your quantity and delivery requirements to start the procurement process.

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