EP4CE10F17I8L
| Part Description |
Cyclone® IV E Field Programmable Gate Array (FPGA) IC 179 423936 10320 256-LBGA |
|---|---|
| Quantity | 507 Available (as of October 7, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 12 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 256-FBGA (17x17) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 256-LBGA | Number of I/O | 179 | Voltage | 970 mV - 1.03 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 645 | Number of Logic Elements/Cells | 10320 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 423936 |
Overview of EP4CE10F17I8L – Cyclone® IV E Field Programmable Gate Array (FPGA) IC 179 423936 10320 256-LBGA
The EP4CE10F17I8L is an Intel Cyclone IV E field programmable gate array (FPGA) offered in a 256-ball BGA package. It delivers a balanced combination of programmable logic, on-chip memory, and a broad I/O complement for embedded and industrial FPGA designs.
With 10,320 logic elements, approximately 0.42 Mbits of embedded memory, 179 user I/O pins and a low-voltage core rail, this device targets designs that require moderate logic density, substantial I/O counts and industrial operating range.
Key Features
- Core Logic 10,320 logic elements provide the programmable fabric for custom logic implementation and system integration.
- Embedded Memory Approximately 0.42 Mbits (423,936 bits) of on-chip RAM to support buffering, FIFOs and small data stores without external memory.
- I/O Capacity 179 user I/O pins enable broad peripheral connectivity and parallel interfaces for complex designs.
- Power Supply Core voltage specified from 0.970 V to 1.03 V allowing precise low-voltage operation for power-conscious designs.
- Package & Mounting 256-ball BGA package; supplier device package listed as 256-FBGA (17×17). Surface-mount mounting type supports compact board-level integration.
- Industrial Temperature & Grade Rated for operation from −40 °C to 100 °C and specified as Industrial grade for demanding ambient environments.
- Standards Compliance RoHS compliant for environmental and manufacturing process alignment.
Typical Applications
- Industrial control and automation Industrial-grade temperature range and robust I/O count suit factory automation, motion control interfaces and PLC complementing.
- Embedded processing and glue logic Moderate logic density and on-chip RAM enable integration of custom peripherals, protocol bridges and hardware accelerators.
- Communications and networking node functions High I/O availability supports parallel interfaces and control planes in networking subsystems and infrastructure gear.
Unique Advantages
- Balanced logic density: 10,320 logic elements deliver sufficient capacity for mid-range FPGA designs without over-provisioning.
- On-chip memory for system efficiency: Approximately 0.42 Mbits of embedded RAM reduces dependence on external memory for buffering and small data structures.
- High I/O count: 179 user I/O pins enable flexible interfacing to sensors, peripherals and parallel buses, simplifying board-level routing.
- Industrial robustness: Operation from −40 °C to 100 °C and an Industrial grade designation support deployment in harsher environments.
- Compact surface-mount BGA packaging: 256-ball BGA (supplier package 256-FBGA, 17×17) provides a small footprint for high-density PCB layouts.
- Low-voltage core operation: Specified core rail from 0.970 V to 1.03 V allows integration into modern low-voltage power architectures.
Why Choose EP4CE10F17I8L?
The EP4CE10F17I8L positions itself as a mid-density Cyclone IV E FPGA option delivering a practical mix of logic, memory and I/O for embedded and industrial designs. Its industrial temperature rating, ample I/O and compact BGA package make it well suited to control, communication and embedded applications where board space and environmental resilience are important.
Choosing this device offers designers a predictable, verified Cyclone IV family solution with on-chip resources that help minimize external component count and simplify system architecture for long-term, supported FPGA deployment.
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