EP4CE10F17I7N

The EP4CE10F17I7N is a Cyclone® IV E Field Programmable Gate Array (FPGA) IC manufactured by Intel. It provides mid-range programmable logic capacity in a compact BGA package for embedded and industrial applications.

Key characteristics include 10,320 logic elements, approximately 0.424 Mbits of on-chip RAM, 179 user I/O pins, a low-voltage core supply range of 1.15 V to 1.25 V, and an industrial operating temperature range of −40°C to 100°C, making it suitable for designs that require moderate logic density, on-chip memory, and robust temperature performance.

Key Features

• Core Logic  10,320 logic elements provide mid-range programmable logic capacity for implementing custom logic, state machines, and glue-logic functions.
• Embedded Memory  Approximately 0.424 Mbits of on-chip RAM (423,936 total RAM bits) for buffering, FIFOs, and small data structures without external memory.
• I/O Capacity  179 available I/O pins support a wide set of external interfaces and signal connections on a single device.
• Power Supply  Core supply range from 1.15 V to 1.25 V to match targeted system power rails and power-management schemes.
• Package & Mounting  256-LBGA package; supplier device package listed as 256-FBGA (17×17). Surface-mount mounting type for standard PCB assembly processes.
• Industrial Temperature Range  Rated for operation from −40°C to 100°C to meet demanding environmental requirements.
• Compliance  RoHS-compliant construction for environmental and regulatory compatibility.

Unique Advantages

• Right-sized Logic Density: 10,320 logic elements balance capacity and cost for mid-range FPGA designs where discrete ASICs are not justified.
• On-chip Memory: Approximately 0.424 Mbits of embedded RAM reduces reliance on external memory for buffering and small-data storage, simplifying board design.
• Ample I/O: 179 I/O pins enable multiple peripheral connections and interface options without additional I/O expanders.
• Industrial Reliability: Specified operation from −40°C to 100°C supports deployment in environments with wide temperature variation.
• Compact Board Footprint: 256-ball BGA package (supplier 256-FBGA, 17×17) provides a high-pin-count solution in a compact area for dense system integration.
• Low-voltage Core Operation: 1.15 V to 1.25 V core supply reduces core power draw and aligns with modern low-voltage system designs.

Why Choose EP4CE10F17I7N?

The EP4CE10F17I7N delivers a balanced combination of programmable logic, embedded memory, and high I/O count in a compact BGA package. Its Cyclone IV E architecture and Intel/Altera documentation support allow engineers to integrate moderate logic complexity with predictable thermal and power requirements.

This device is well suited for development teams and procurement looking for an industrial-grade, RoHS-compliant FPGA with clear, verifiable specifications for logic capacity, on-chip RAM, I/O, supply voltage, package, and operating temperature.

Request a quote or submit a procurement inquiry to receive pricing and availability for the EP4CE10F17I7N.