EP4CE10F17I8LN

The EP4CE10F17I8LN is a Cyclone® IV Field Programmable Gate Array (FPGA) from Intel, offering 10,320 logic elements and approximately 0.42 Mbits of embedded memory. This surface-mount device comes in a 256-ball BGA package with a supplier package specified as 256-FBGA (17×17).

Designed for industrial-grade applications, the device provides 179 general-purpose I/Os, a core voltage supply range of 970 mV to 1.03 V, and an extended operating temperature range of −40 °C to 100 °C. Documentation and device handbook support are available for system-level integration and design reference.

Key Features

• Logic Capacity  10,320 logic elements to implement combinational and sequential logic, state machines, and custom datapaths.
• Embedded Memory  Approximately 0.42 Mbits of on-chip RAM for buffering, FIFOs, and small on-chip data storage.
• I/O Density  179 I/O pins to support wide parallel interfaces, multiple peripherals, and flexible board-level connectivity.
• Power and Core Supply  Core voltage supply specified from 970 mV to 1.03 V for compatible low-voltage system designs.
• Package Options  256-LBGA package case with supplier device package 256-FBGA (17×17) for compact, high-density board mounting.
• Industrial Operating Range  Rated for −40 °C to 100 °C, suitable for industrial temperature environments.
• RoHS Compliant  Manufactured to meet RoHS environmental requirements.

Typical Applications

• Industrial Control and Automation  Use the device’s industrial temperature rating and extensive I/O for sensor interfacing, motor control logic, and factory automation interfaces.
• Data Acquisition and Instrumentation  Leverage on-chip RAM and logic capacity to implement sampling engines, data buffering, and front-end signal processing.
• Embedded System Integration  Integrate custom peripherals, glue logic, and protocol bridging with abundant I/O and programmable logic resources.
• Prototyping and System-Level Development  Ideal for validating hardware architectures and accelerating development where a moderate logic footprint and dense I/O are required.

Unique Advantages

• Balanced Logic and Memory  10,320 logic elements combined with approximately 0.42 Mbits of embedded RAM provide a compact yet capable platform for mid-range FPGA functions.
• High I/O Count  179 I/Os reduce the need for external expanders and simplify board-level interfacing for multi-sensor or multi-peripheral designs.
• Industrial-Ready Temperature Range  Rated from −40 °C to 100 °C to support deployments in challenging thermal environments.
• Compact BGA Packaging  256-LBGA / 256-FBGA (17×17) packaging enables a small PCB footprint while preserving routing density for high-pin-count designs.
• Low-Voltage Core  Core supply range of 970 mV to 1.03 V supports modern low-voltage system architectures and power-optimized designs.

Why Choose EP4CE10F17I8LN?

The EP4CE10F17I8LN places a practical balance of logic, memory, and I/O into a single industrial-grade Cyclone IV FPGA package. Its specification set — including 10,320 logic elements, roughly 0.42 Mbits of embedded RAM, 179 I/Os, and a compact 256-ball BGA footprint — makes it suitable for engineers building mid-sized FPGA-based subsystems where I/O density and reliable operation across temperature are priorities.

Backed by Intel’s Cyclone IV device documentation and datasheet material, this part is appropriate for teams that require a documented, industrial-rated FPGA platform for control, acquisition, and integration tasks with predictable electrical and thermal characteristics.

Request a quote or submit an inquiry to receive pricing, availability, and technical support information for EP4CE10F17I8LN.