EP4CE10F17C9LN

The EP4CE10F17C9LN is a Cyclone® IV E field-programmable gate array (FPGA) manufactured by Intel. It delivers a mid-range programmable logic resource set and on-chip memory in a compact 256‑ball BGA package suited for commercial embedded designs.

With 10,320 logic elements, approximately 0.42 Mbits of embedded memory, and 179 general-purpose I/Os, this device is aimed at designs that require moderate logic density, flexible I/O connectivity, and low-voltage core operation.

Key Features

• Logic Capacity — 10,320 logic elements to implement custom digital functions and state machines.
• Embedded Memory — Approximately 0.42 Mbits of on-chip RAM (423,936 total RAM bits) for FIFOs, buffers, and local data storage.
• I/O Resources — 179 I/Os to support multiple interfaces, bus bridging, and parallel/serial connectivity.
• Core Voltage — Supported supply range from 0.970 V to 1.03 V for the device core.
• Package & Mounting — Surface-mount 256‑LBGA package; supplier device package listed as 256‑FBGA (17×17), enabling compact board-level integration.
• Operating Range — Commercial-grade operation from 0 °C to 85 °C.
• Regulatory — RoHS‑compliant for lead‑free manufacturing requirements.

Typical Applications

• Commercial Embedded Systems — Implement control logic, glue logic, and protocol handling within devices that operate in commercial temperature ranges.
• I/O‑Rich Interfaces — Use the 179 I/Os for board-level bridging between parallel buses, sensors, displays, and peripheral interfaces.
• On‑Chip Memory Utilization — Leverage approximately 0.42 Mbits of embedded RAM for buffering, small packet storage, and temporary data structures.
• Prototyping and Custom Logic — Deploy as a mid-range FPGA resource for validating custom algorithms, state machines, and timing-critical logic.

Unique Advantages

• Balanced Logic and Memory: 10,320 logic elements paired with approximately 0.42 Mbits of embedded memory provide a practical balance for many mid-range designs.
• High I/O Count: 179 I/Os enable flexible interfacing and reduce the need for external glue logic or multiple interface converters.
• Compact Surface‑Mount Package: The 256‑LBGA (supplier: 256‑FBGA, 17×17) minimizes PCB footprint while supporting robust board assembly.
• Low‑Voltage Core: Narrow core supply range (0.970–1.03 V) helps designers target consistent power delivery and predictable thermal profiles.
• Commercial Temperature Rating: Rated for 0 °C to 85 °C operation to match typical commercial electronic product environments.
• RoHS Compliance: Conforms to lead‑free manufacturing requirements for modern assembly processes.

Why Choose EP4CE10F17C9LN?

The EP4CE10F17C9LN positions itself as a practical, mid-range Cyclone IV E FPGA from Intel that combines a solid logic element count with meaningful on-chip RAM and a high I/O complement. Its low-voltage core and compact 256‑ball package make it suitable for space-constrained commercial embedded designs that require flexible interfacing and local memory resources.

This device is well suited for engineers developing prototypes or production systems that need a balance of integration, moderate logic density, and predictable commercial-temperature operation, backed by Intel's Cyclone IV device documentation and support materials.

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