EP4CE10F17I7

IC FPGA 179 I/O 256FBGA
Part Description

Cyclone® IV E Field Programmable Gate Array (FPGA) IC 179 423936 10320 256-LBGA

Quantity 1,143 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time12 Weeks
Datasheet

Specifications & Environmental

Device Package256-FBGA (17x17)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case256-LBGANumber of I/O179Voltage1.15 V - 1.25 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs645Number of Logic Elements/Cells10320
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits423936

Overview of EP4CE10F17I7 – Cyclone® IV Field Programmable Gate Array (256‑LBGA, Industrial)

The EP4CE10F17I7 is an Intel Cyclone® IV field programmable gate array (FPGA) provided in a 256‑ball L‑BGA package. It integrates 10,320 logic elements and approximately 0.42 Mbits of embedded memory to support mid‑density programmable logic designs.

Designed for surface‑mount assembly and industrial operation, the device offers 179 general I/O pins, a low core voltage range of 1.15 V to 1.25 V, and an operating temperature range of -40 °C to 100 °C, making it suitable for applications that require compact integration and industrial temperature capability.

Key Features

  • Logic Capacity  10,320 logic elements providing mid‑density programmable logic resources for combinational and sequential functions.
  • Embedded Memory  Approximately 0.42 Mbits of on‑chip RAM to support buffering, LUT‑based storage and small block memories.
  • I/O Count  179 device I/O pins to accommodate multiple peripheral interfaces and board‑level connectivity requirements.
  • Power and Voltage  Core supply range of 1.15 V to 1.25 V to match low‑voltage system domains and reduce power dissipation at the core.
  • Package and Mounting  256‑LBGA package for compact surface‑mount placement (supplier device package listed as 256‑FBGA, 17×17 mm footprint).
  • Industrial Temperature Grade  Rated for operation from -40 °C to 100 °C for reliable performance across extended temperature environments.
  • Regulatory Compliance and Documentation  RoHS‑compliant device with detailed Cyclone IV device handbook and datasheet coverage for operating conditions, DC characteristics, I/O standards and power/switching specifications.

Unique Advantages

  • Balanced Logic and Memory Resources: The combination of 10,320 logic elements and embedded RAM (~0.42 Mbits) enables efficient implementation of medium‑complexity FPGA designs without excessive board space.
  • High I/O Count in a Compact Package: 179 I/Os in a 256‑ball LBGA footprint helps reduce board area while maintaining flexible external connectivity.
  • Industrial Temperature Range: Rated from -40 °C to 100 °C, suitable for systems that require extended environmental tolerance.
  • Low Core Voltage Operation: 1.15 V to 1.25 V core supply supports low‑power system architectures and modern supply domains.
  • Surface‑Mount Ready: Provided in a standard BGA package intended for automated surface‑mount assembly, simplifying manufacturing integration.
  • Standards and Documentation Support: Backed by Cyclone IV device handbook content covering operating conditions, DC characteristics, I/O standards, power consumption and switching characteristics for design verification.

Why Choose EP4CE10F17I7?

The EP4CE10F17I7 positions itself as a compact, industrial‑grade Cyclone IV FPGA that balances programmable logic capacity, on‑chip memory and a high I/O count in a 256‑LBGA package. Its low core voltage and extended temperature rating make it a practical choice for embedded systems and industrial electronics that require reliable operation across a wide temperature range.

With manufacturer documentation available through the Cyclone IV device handbook and detailed datasheet content, the EP4CE10F17I7 offers engineers the technical references needed to integrate the device into mid‑density FPGA designs while maintaining RoHS compliance and surface‑mount manufacturing compatibility.

Request a quote or submit a parts inquiry to receive pricing and availability for the EP4CE10F17I7. Our team can provide procurement details and lead‑time information to support your design and production planning.

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