EP4CE115F23C8

The EP4CE115F23C8 is a Cyclone® IV E family Field Programmable Gate Array (FPGA) from Intel. It provides a large pool of programmable logic resources and embedded memory in a surface‑mount 484‑BGA package for commercial electronic designs.

With 114,480 logic elements, approximately 3.98 Mbits of on‑chip RAM, and up to 280 user I/Os, this device is intended for commercial applications that require substantial programmable logic capacity, mid‑density embedded memory, and flexible I/O provisioning while operating within a 0 °C to 85 °C temperature range and a 1.15 V to 1.25 V core supply window.

Key Features

• Core Logic 114,480 logic elements provide substantial programmable logic capacity for complex combinational and sequential designs.
• Embedded Memory Approximately 3.98 Mbits of on‑chip RAM for buffering, FIFOs, and implemented state machines.
• I/O Resources Up to 280 general‑purpose I/O pins to interface with peripherals and external devices.
• Power Core voltage supply range of 1.15 V to 1.25 V to match standard Cyclone IV E device requirements.
• Package & Mounting 484‑BGA package (supplier device package: 484‑FBGA, 23×23) designed for surface‑mount assembly.
• Operating Range Commercial grade operation from 0 °C to 85 °C.
• Environmental Compliance RoHS‑compliant construction to support regulatory and manufacturing requirements.

Typical Applications

• Commercial Embedded Systems — Programmable logic capacity and I/O count suitable for commercial embedded applications that require substantial on‑chip resources.
• Prototyping and Development — Surface‑mount 484‑BGA package and documented Cyclone IV device handbook support hardware evaluation and design iterations.
• Digital Signal and Control Functions — Large logic element count and embedded RAM enable implementation of signal processing blocks, control logic, and data buffering within a single device.

Unique Advantages

• High logic capacity: 114,480 logic elements provide headroom for complex logic implementations without immediate need for multiple devices.
• Substantial embedded memory: Approximately 3.98 Mbits of on‑chip RAM reduces external memory dependency for many buffering and state storage needs.
• Flexible I/O count: Up to 280 I/Os allow broad external interfacing options for sensors, peripherals, and custom buses.
• Compact, assembly‑ready package: 484‑BGA (23×23) surface‑mount package suits modern PCB assembly workflows.
• Commercial temperature rating: 0 °C to 85 °C aligns with standard commercial deployments.
• Regulatory readiness: RoHS compliance supports environmentally conscious manufacturing and supply-chain requirements.

Why Choose EP4CE115F23C8?

The EP4CE115F23C8 combines a high number of logic elements, several megabits of embedded RAM, and a broad I/O complement in a single Cyclone IV E FPGA package from Intel. This balance of resources is well suited to commercial designs that require on‑chip integration of logic, memory, and interfaces while maintaining standard commercial operating and assembly parameters.

Backed by Cyclone IV family documentation and datasheet resources, the EP4CE115F23C8 is a pragmatic choice for engineering teams aiming to consolidate functionality, reduce board complexity, and accelerate time‑to‑market within commercial application domains.

Request a quote or submit an inquiry to receive pricing and availability information for the EP4CE115F23C8. Our team can provide lead‑time details and assist with procurement and technical documentation requests.