EP4CE115F23C8LN

The EP4CE115F23C8LN is an Intel Cyclone IV E FPGA delivering a high-density programmable logic fabric with 114,480 logic elements, approximately 3.98 Mbits of embedded memory, and 280 user I/Os. Packaged in a compact 484-FBGA (23×23) surface-mount package, the device targets designs that require substantial logic capacity and flexible I/O in a commercial-temperature-grade FPGA.

Engineered for designers who need programmable logic, on-chip memory, and a large I/O complement within a single, RoHS-compliant device, this part provides the core resources needed for complex custom digital implementations while operating from a documented core voltage range of 0.97 V to 1.03 V.

Key Features

• Logic Capacity  Approximately 114,480 logic elements to implement complex custom logic and parallel processing functions.
• Embedded Memory  Approximately 3.98 Mbits of on-chip RAM to support buffering, lookup tables, and local data storage without external memory.
• I/O Resources  280 user I/Os to support wide, parallel interfaces and multiple peripheral connections.
• Package  484-FBGA (23×23) surface-mount package offering a high pin-count footprint for dense interconnects in compact board layouts.
• Power Supply  Documented core supply range from 0.970 V to 1.03 V for the device core domain.
• Operating Range  Commercial-grade operation from 0 °C to 85 °C to match typical commercial embedded environments.
• Compliance  RoHS-compliant for regulatory conformity in lead-free assemblies.
• Documentation  Supported by the Cyclone IV device handbook and detailed datasheet content covering operating conditions, DC characteristics, timing, and power consumption.

Typical Applications

• Prototyping & Development: Use the device’s large logic and memory resources to validate and iterate complex digital designs on development platforms.
• Custom Digital Processing: Implement application-specific data-paths and parallel processing functions leveraging the high logic element count and on-chip RAM.
• I/O-Intensive Interface Bridging: Bridge multiple parallel or serial interfaces and manage protocol translation with the device’s 280 I/Os.

Unique Advantages

• High Logic Density: Large logic element count enables consolidation of multiple functions into a single FPGA, reducing board-level complexity.
• Substantial On-Chip Memory: Nearly 4 Mbits of embedded RAM supports buffering and local data storage, decreasing reliance on external memory.
• Extensive I/O Count: 280 I/Os provide design flexibility for wide buses, parallel sensors, or multiple peripheral connections.
• Compact, High-Pin-Count Package: 484-FBGA (23×23) balances high interconnect density with a compact board footprint for space-constrained designs.
• Commercial Temperature and RoHS Compliance: Commercial operating range (0 °C to 85 °C) and RoHS compliance support standard commercial product deployments and lead-free assembly processes.
• Documented Electrical and Timing Data: Device handbook and datasheet content provide the necessary electrical, switching, and power characteristics for system integration and validation.

Why Choose EP4CE115F23C8LN?

The EP4CE115F23C8LN combines high logic capacity, substantial embedded memory, and a broad I/O complement in a single commercial-grade FPGA package, making it well suited to designs that require programmable logic density and flexible interfacing. Its documented core supply range and comprehensive datasheet materials support disciplined hardware design and validation.

This device is a fit for design teams and procurement groups building mid- to high-density programmable logic solutions that value on-chip memory, extensive I/O, and a compact BGA footprint, backed by available device documentation for electrical and timing characteristics.

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