EP4CE115F23I7

The EP4CE115F23I7 is an Intel Cyclone® IV E field‑programmable gate array (FPGA) integrated circuit offering a high logic capacity and on‑chip memory in a compact ball‑grid array package. It combines 114,480 logic elements with approximately 3.98 Mbits of embedded RAM and 280 user I/Os to support complex programmable logic implementations.

Designed for industrial deployments, the device operates over a wide temperature range and uses a low‑voltage core supply, making it suitable for applications that demand substantial programmable logic, significant embedded memory, and robust environmental tolerance.

Key Features

• Logic Capacity — 114,480 logic elements to implement large custom digital functions and parallel processing architectures.
• Embedded Memory — Approximately 3.98 Mbits of on‑chip RAM to support buffering, state machines, and memory‑intensive logic functions without external memory.
• I/O Density — 280 user I/Os to connect with peripherals, sensors, interfaces, and external devices while enabling flexible board partitioning.
• Power and Core Supply — Core voltage supply range of 1.15 V to 1.25 V to match system power rails and enable low‑voltage core operation.
• Package and Mounting — 484‑BGA package (supplier device package: 484‑FBGA, 23×23) with surface‑mount mounting type for compact PCB integration.
• Industrial Temperature Range — Rated for operation from −40°C to 100°C, targeting industrial environments where extended temperature tolerance is required.
• Environmental Compliance — RoHS compliant for reduced hazardous substance content.
• Documentation Support — Part of the Cyclone IV device family with dedicated Cyclone IV Device Handbook documentation for device specifications and design guidance.

Typical Applications

• Industrial Control Systems — Programmable logic and interfacing in factory automation, motor control, and process control applications that benefit from industrial temperature tolerance.
• High‑Density I/O Aggregation — Systems requiring many parallel I/Os for sensor arrays, data concentrators, or custom interfaces using the device’s 280 user I/Os.
• On‑Chip Memory‑Centric Logic — Designs that leverage approximately 3.98 Mbits of embedded RAM for buffering, FIFOs, and temporary storage without relying on external memory.

Unique Advantages

• Substantial Logic Resources: 114,480 logic elements enable implementation of complex digital algorithms and custom accelerators on a single FPGA.
• Integrated Memory Reduces BOM: Approximately 3.98 Mbits of embedded RAM minimizes the need for external memory components in many designs.
• High I/O Count for System Integration: 280 user I/Os simplify board layouts by supporting multiple peripheral and interface connections directly.
• Industrial‑Grade Operation: Specified operation from −40°C to 100°C supports deployments in temperature‑challenging environments.
• Compact BGA Packaging: 484‑FBGA (23×23) surface‑mount package offers a small footprint for space‑constrained PCBs while providing high pin density.
• Standards‑Aware Manufacturing: RoHS compliance helps meet environmental and regulatory requirements for product assemblies.

Why Choose EP4CE115F23I7?

The EP4CE115F23I7 provides a balanced combination of large programmable logic capacity, substantial embedded memory, and high I/O density in a compact 484‑BGA package, positioned for industrial applications that require reliable operation across a wide temperature range. Its low core voltage and family documentation (Cyclone IV device handbook) support integration into power‑sensitive and well‑documented design flows.

This device is well suited to engineers and system designers building industrial control, I/O‑heavy, or memory‑centric FPGA solutions who need a robust, high‑capacity programmable device with verified environmental compliance.

If you would like pricing, availability, or a formal quote for EP4CE115F23I7, request a quote or submit an inquiry to discuss your requirements and procurement options.