EP4CE115F23C9LN

The EP4CE115F23C9LN is a Cyclone® IV E Field Programmable Gate Array (FPGA) in a 484‑BGA package designed for commercial applications. It delivers high-density programmable logic with a large on‑chip memory complement and an extensive I/O count for complex digital designs.

Key capabilities include 114,480 logic elements, approximately 3.98 Mbits of embedded memory, and 280 user I/O pins. The device targets engineers needing a scalable, low‑voltage core FPGA solution in a compact surface‑mount BGA package.

Key Features

• Core Logic 114,480 logic elements provide substantial capacity for implementing custom digital functions and complex state machines.
• Embedded Memory Approximately 3.98 Mbits of on‑chip RAM for buffering, FIFOs, and local data storage within programmable fabric.
• I/O Density 280 user I/O pins enable broad interfacing options to peripherals, memory, and external logic.
• Low‑Voltage Core Core supply specified from 970 mV to 1.03 V to match system power‑rail designs and optimize power delivery.
• Package & Mounting 484‑ball BGA (484‑FBGA, 23×23) in a surface‑mount form factor for space‑efficient PCB integration.
• Operating Range & Grade Commercial grade device with operating temperature range 0 °C to 85 °C suitable for a wide range of non‑automotive applications.
• Standards & Compliance RoHS‑compliant manufacturing status.
• Documentation Detailed device specifications and performance characteristics are provided in the Cyclone IV device handbook referenced in the product datasheet.

Typical Applications

• Custom Digital Logic — Implement complex custom logic, finite state machines, and glue‑logic using 114,480 logic elements and embedded RAM.
• Data Buffering and Local Storage — Use approximately 3.98 Mbits of on‑chip RAM for buffering, FIFOs, and packet storage in data path designs.
• High‑PIN Interfacing — Take advantage of 280 I/O pins for parallel interfaces, peripheral bridging, or multi‑lane connectivity to external devices.
• Compact Board Designs — The 484‑BGA surface‑mount package supports high‑density PCB layouts where board space is constrained.

Unique Advantages

• High Logic Capacity: 114,480 logic elements enable large‑scale designs without immediate need for external glue logic.
• Significant On‑Chip Memory: Approximately 3.98 Mbits of embedded RAM reduces dependence on external memory for many buffering and caching tasks.
• Extensive I/O Count: 280 user I/O pins provide flexibility to connect multiple peripherals and interfaces directly to the FPGA.
• Compact BGA Packaging: 484‑FBGA (23×23) footprint supports dense, manufacturable PCB layouts while maintaining thermal and signal integrity typical of BGA packages.
• Low‑Voltage Core: Core voltage specified between 970 mV and 1.03 V supports modern power distribution schemes and efficient power budgeting.
• Commercial‑Grade Reliability: Specified operating temperature of 0 °C to 85 °C and RoHS compliance align with standard commercial application requirements.

Why Choose EP4CE115F23C9LN?

The EP4CE115F23C9LN positions itself as a high‑capacity, commercially graded Cyclone IV E FPGA for designers needing substantial programmable logic, embedded memory, and I/O resources in a compact surface‑mount BGA package. Its combination of 114,480 logic elements, approximately 3.98 Mbits of on‑chip RAM, and 280 I/Os makes it suitable for sophisticated custom logic implementations and dense board designs.

Backed by the Cyclone IV device handbook documentation, this device provides a verifiable specification set for development teams focused on scalability, integration, and predictable electrical and thermal behavior in commercial environments.

If you need pricing, availability, or a formal quote for EP4CE115F23C9LN, submit a request or inquiry through your preferred procurement channel and include the part number for a prompt response.