EP4CE115F23I8LN
| Part Description |
Cyclone® IV E Field Programmable Gate Array (FPGA) IC 280 3981312 114480 484-BGA |
|---|---|
| Quantity | 449 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 16 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 484-FBGA (23x23) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 484-BGA | Number of I/O | 280 | Voltage | 970 mV - 1.03 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 7155 | Number of Logic Elements/Cells | 114480 | ||
| Number of Gates | N/A | ECCN | 3A001A7A | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 3981312 |
Overview of EP4CE115F23I8LN – Cyclone® IV E FPGA, 114,480 logic elements, ~3.98 Mbits, 280 I/Os, 484‑BGA
The EP4CE115F23I8LN is an industrial‑grade Cyclone® IV E field programmable gate array (FPGA) in a 484‑BGA package. It delivers high logic density and on‑chip memory in a surface‑mount FBGA package suitable for programmable logic implementations.
With 114,480 logic elements, approximately 3.98 Mbits of embedded RAM, 280 I/Os and a core supply range of 0.97–1.03 V, this device targets applications that require dense programmable logic, significant on‑chip memory and broad I/O connectivity within an industrial temperature range.
Key Features
- Core Logic 7,155 configurable logic blocks (CLBs) providing a total of 114,480 logic elements for implementing complex custom logic.
- Embedded Memory Approximately 3.98 Mbits of on‑chip RAM to support buffering, state machines and local data storage without external memory.
- I/O Capacity 280 I/O pins to support extensive peripheral and bus interfacing across multiple domains.
- Power Supply Core voltage specified between 0.97 V and 1.03 V for precise power budgeting and compatibility with regulated power rails.
- Package & Mounting 484‑FBGA (23×23) surface‑mount package (484‑BGA case) for compact board footprints and high pin‑count integration.
- Operating Range & Grade Industrial grade device rated for operation from –40 °C to 100 °C; RoHS compliant for regulatory alignment.
- Documentation Part of the Cyclone IV family with detailed device handbook and datasheet coverage for operating conditions, DC characteristics and switching specifications.
Typical Applications
- Industrial Control Use the industrial temperature rating, extensive I/O and high logic density to implement custom control, monitoring and interface logic.
- Communications Equipment Large logic capacity and on‑chip RAM support protocol handling and logic partitioning within networking or telecom gear.
- Embedded System Integration Integrate peripheral bridging, custom accelerators and glue logic in compact systems using the 484‑FBGA package and 280 I/Os.
Unique Advantages
- High Logic Density: 114,480 logic elements enable complex digital designs without immediate need for multiple devices.
- Significant On‑Chip Memory: Approximately 3.98 Mbits of embedded RAM reduces reliance on external memory for many control and buffering tasks.
- Robust Industrial Operation: –40 °C to 100 °C operating range and industrial grading support deployment in demanding environments.
- Broad I/O Connectivity: 280 I/Os provide flexibility for multi‑channel interfaces, sensor arrays and parallel buses.
- Compact High‑Pin Package: 484‑FBGA (23×23) offers a high pin count in a compact footprint for space‑constrained designs.
- Standards Compliance: RoHS compliance supports regulatory requirements for many commercial and industrial products.
Why Choose EP4CE115F23I8LN?
The EP4CE115F23I8LN positions itself as a high‑density, industrial‑grade Cyclone IV E FPGA optimized for applications requiring substantial programmable logic, on‑chip RAM and extensive I/O in a compact FBGA package. Its combination of 114,480 logic elements, approximately 3.98 Mbits of embedded memory and 280 I/Os provides a balanced platform for integrating custom digital functions and interface logic.
This device is suited to engineers and procurement teams developing industrial control systems, communications equipment and embedded solutions that need reliable operation across –40 °C to 100 °C. Detailed device documentation is available for those who require in‑depth electrical, timing and operating condition specifications to support design and validation.
Request a quote or submit an inquiry to obtain pricing, availability and ordering information for the EP4CE115F23I8LN.

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