EP4CE115F29C7N

The EP4CE115F29C7N is a Cyclone IV E family FPGA offering a high-density programmable logic fabric for embedded and system designs. It combines substantial logic capacity, embedded memory, and a large I/O complement in a compact ball grid array package.

This device is suited for designs that require extensive programmable logic and on-chip memory with a focus on integration and system-level I/O — delivered in a commercial-grade FPGA with documented device specifications in the Cyclone IV Device Handbook.

Key Features

• Programmable Logic Capacity — 114,480 logic elements provide extensive resources for implementing complex digital logic and state machines.
• Embedded Memory — Approximately 3.98 Mbits of on-chip RAM to support buffers, FIFOs, and memory-intensive logic functions.
• I/O Resources — 528 user I/O pins to support dense peripheral interfaces and board-level connectivity.
• Power — Core voltage supply range of 1.15 V to 1.25 V for the FPGA core.
• Package and Mounting — 780-ball FBGA (29×29) / 780-BGA package in a surface-mount form factor for space-efficient PCB integration.
• Operating Conditions — Commercial temperature grade with an operating range of 0 °C to 85 °C.
• RoHS Compliance — Device is RoHS compliant.
• Documented Specification — Supported by the Cyclone IV Device Handbook and device datasheet for detailed electrical and timing characteristics.

Typical Applications

• High-density digital logic — Use the large logic element count to consolidate multiple discrete functions into a single programmable device.
• Memory-backed processing — Embedded RAM (approximately 3.98 Mbits) supports buffering, packet processing, and on-chip data handling.
• Dense I/O interfacing — 528 I/O pins enable integration with a wide range of peripherals, sensors, and board-level buses.

Unique Advantages

• Significant logic resources — 114,480 logic elements allow implementation of complex logic without external glue logic, reducing PCB BOM.
• Integrated on-chip memory — Nearly 4 Mbits of embedded RAM simplifies designs that need local storage and low-latency access.
• High I/O count — 528 user I/Os facilitate multiple parallel interfaces and flexible pin assignments.
• Compact BGA package — 780-FBGA (29×29) delivers high pin count in a compact footprint for space-constrained boards.
• Commercial-grade operating range — Rated for 0 °C to 85 °C to match standard commercial applications.
• Standards-conscious compliance — RoHS-compliant construction supports modern manufacturing and environmental requirements.

Why Choose EP4CE115F29C7N?

The EP4CE115F29C7N positions itself as a high-capacity, integrated FPGA option within the Cyclone IV E family, offering a balance of logic density, embedded memory, and extensive I/O in a single surface-mount BGA package. Its documented device specifications and Cyclone IV Device Handbook support design validation and integration.

This part is well suited for engineers building complex programmable systems that require substantial on-chip logic and memory resources with a high I/O count, and for teams that prioritize clear device documentation and RoHS compliance.

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